About Us
In today's competitive market, if you want to succeed you have to get a working chip as fast as possible. But that's easier said than done. At every phase of development there are huge obstacles to surmount: chip complexity, multiple suppliers, integration challenges and time-to-market pressures. These obstacles directly affect reliability, profitability and ultimately your company's reputation. That's why there's eSilicon.
At eSilicon, we offer comprehensive services and a proprietary infrastructure that overcome these obstacles so you can meet the ever-increasing demands of your market. It's a flexible, low-cost, lower-risk path to silicon - tailored to your specific requirements. The key is our integrated approach that incorporates design, productization and manufacturing services into a seamless environment, all brought together by our patented infrastructure. We call it eSilicon Enterprise™, and it enables superior predictability and faster time-to-market for your chip design.
Our approach also gives you competitive advantages traditional ASIC suppliers simply can't match. They are locked into a set group of suppliers, and therefore the technologies they offer are limited. This results in dramatically reduced flexibility and higher operating costs, two factors that can keep quality silicon from reaching the market.
At eSilicon, we have access to a wide range of technologies from our extensive network of Value Chain partners, making it possible for us to provide customized solutions for your needs - solutions based on the industry's best and most advanced chip technologies. eSilicon creates an optimized Value Chain for each customer and each design, resulting in substantial flexibility and lower operating costs. So you not only achieve silicon in record time, you can also easily adapt to market changes as they emerge.
Proven Track Record
eSilicon has proven successes in a wide range of markets, from consumer, digital imaging and networking solutions to communications, medical and storage devices. And for the more than 35 million chips we have shipped to date, we have achieved a 100% timing closure success rate and a 98% first-time silicon success rate - impressive results that are difficult to achieve with alternative solutions.
Unbeatable Advantage
However you look at it, eSilicon offers the advantages you need to succeed. Here is just some of what we offer:
- Significantly reduced design, fixed overhead and manufacturing costs
- Much lower technical, execution and financial risk
- Variety of engagement solutions custom-tailored to your needs
- Experienced design talent and manufacturing expertise
- Access to world-class IP
- Increased flexibility for greater response to changing market needs
- Proven Value Chain relationships and success rates
With eSilicon, your company can focus on its core values, maximizing competitiveness and profitability.
Value Chain Producer
Each design is different. So eSilicon doesn't force your design into a rigid process. Instead, we embrace the differences and create an optimized Value Chain to address the unique requirements of each customer and each design.
Based on your specific needs, we create a unique semiconductor Value Chain which includes:
- Design services and third party IP
- Wafer fabrication
- Package, assembly and test
And with our comprehensive approach, we seamlessly integrate your skills, our expertise and a global Value Chain to produce the best path to silicon for your chip.
Optimized Value Chain
At eSilicon, all we do is custom chips, so our core competencies are devoted to our singular mission. Our design, productization and manufacturing services - backed by our patented, comprehensive eSilicon Enterprise infrastructure - give you a flexible, low-cost and lower-risk way to achieve silicon.
Our design services include:
- Physical implementation: place & route, timing analysis, extraction, verification and DRC
- DFT/DFM: testability analysis, test development and manufacturing process analysis
- Package design: custom package design, thermal analysis and chip/package interface simulation
Our productization services include:
- Device qualification: custom qualification programs, stress and life testing
- Fast/slow device characterization
- Yield ramp: test data analysis and process tuning
Our manufacturing services include:
- Long-standing relationship with TSMC, enabling unparalleled manufacturing services
- Multiple suppliers to address standard and custom package needs
- Relationships with both domestic and offshore testing facilities for complete support of your chip requirements.
From process technology to semiconductor IP to implementation strategies, our customized engagement solutions enable you to get the results you want, when you want them.
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