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eSilicon Corporate Fact Sheet

eSilicon, the largest independent semiconductor Value Chain Producer (VCP), provides a comprehensive suite of ASIC and SoC design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production of integrated circuits (ICs). The company delivers custom chips (ASICs) to system original equipment manufacturers (OEMs) and fabless semiconductor companies (FSCs) who serve a wide variety of markets including the consumer, computer, communications and industrial segments.

eSilicon creates a unique, optimized semiconductor Value Chain for each customer and each design - from design services and tools, to IP and materials suppliers, to test and packaging providers. By integrating this Value Chain with its internal expertise and proven eSilicon Enterprise™ infrastructure, the ASIC services and solutions provider produces more than 10 million leading-edge chips per year.

About Value Chain Producer:

A Value Chain Producer (VCP) is a company that collaborates with foundries, IP and service providers, EDA suppliers, package, assembly and test operations in designing and producing chips for fabless IC, IDM and OEM companies. VCPs optimize the economics of customer value chains and enable customers to focus on their product differentiation and market growth. A VCP earns revenue by shipping packaged, tested products with the customers' logo. The term was created by eSilicon and was adopted by the Global Semiconductor Alliance (GSA) as a new category in October 2009.

At a Glance:

• Company Founded: 2000
• Employees: 320
• Headquarters: 501 Macara Ave. Sunnyvale, Calif. 94085
• Locations: Sales, Support, Operations and R&D offices located in North America, Europe and Asia

Management Team:

• Jack Harding: Chairman, President and Chief Executive Officer
• Hugh Durdan: Chief Operating Officer
• Jim Lindstrom: Chief Financial Officer
• Gino Skulick: Vice President, Worldwide Sales
• Patrick Soheili: Vice President, Marketing and Business Development
• Duytan Tran: Vice President, SDS Business Unit
                          President, SDS
• Fritz Koehler: Vice President and General Counsel
• John McSorley: Vice President, Human Resources
• Hao Nham: Vice President and General Manager, Design Services
• Prasad Subramaniam: Vice President, Design Technology
• Jerry Qubain: Vice President, Manufacturing Operations
• Ajay Lalwani: Vice President, Strategic Sourcing

Rankings and Awards:

• Named 'Top 200 Private Companies' by Nollenberger Capital Partners (June 2008)
• Named 'Rising Star' in Deloitte's Technology Fast 500 Program (Jan. 2006)
• Ranked #3 in Inc. Magazine annual ranking of 500 fastest-growing private companies in America (Oct. 2005)
• Named by AlwaysOn as one of Top 100 Private Companies (July 2005)
• Named one of Red Herring 100 Private Companies of North America (May 2005)
• Received Fabless Semiconductor Association (FSA) award for Outstanding Financial Performance by a Private Fabless Company (Dec. 2004)
• Named to AlwaysOn list of Top 100 Private Companies (July 2004)
• Wpm Investors' Choice award at MicroVentures Conference (Dec. 2003)
• Named as winner of FSA 'Start Ups to Watch' award (Dec. 2002)

Innovative Business Model:

Prior to 2000, electronics companies that didn't own their own semiconductor fabrication facility had two choices for the development and manufacturing of their application-specific integrated circuits (ASICs). They could use the traditional ASIC business model and work with a large integrated device manufacturer (IDM), which locked them into limited facilities and a narrow intellectual property (IP) portfolio; or they could attempt to manage the process themselves by working directly with a foundry, and take on the associated risks and challenges.

eSilicon pioneered the Fabless ASIC business model to provide a third - and better - alternative. Through this innovative model, eSilicon offers a wide variety of design services; a broad portfolio of proven IP solutions and tools; and a full range of manufacturing support, including the delivery of packaged, tested chips. Its team of experienced designers and operations experts is able to augment a company's internal resources, and its amortized purchasing leverage provides a dependable path to foundry capacity. The result is the development and production of right-first time silicon, delivered reliably, quickly and cost effectively.

Solutions:

eSilicon manages every step of the ASIC development process, from specification through manufacturing and delivery of packaged, tested parts. The company offers a variety of custom engagement solutions to provide a flexible framework for the development of application-specific silicon. Some examples include:

• GDSII Hand-off: eSilicon will take a GDSII layout and manage the fabrication, packaging, test and delivery of the final silicon.
• Netlist Hand-off: eSilicon will take a netlist and perform the physical design, and manage all subsequent manufacturing operations, including fabrication, packaging, test and delivery.
• Production Hand-off: eSilicon will take a completed IC design and provide full production support, including planning, supplier management and qualification, delivery flexibility programs and total supply chain visibility.