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Dmitry Lipkin
eSilicon Corporation
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eSilicon CEO Jack Harding to Participate on Multicore Panel at SoC Conference

Industry executives to discuss challenges of multicore design

WHAT: Jack Harding, chairman, president and CEO of eSilicon Corporation, will participate on a panel discussion at the 6th Annual System on Chip (SoC) Conference, Exhibit and Workshop. He joins executives from AMD, LogicVision, Texas Instruments, Mentor Graphics and Tensilica in a session entitled “Hardware and Software Challenges for Multicore SoCs in Leading-Edge Applications.” The panel will be moderated by Robert Cravotta, technical editor for microprocessors, DSPs and tools at EDN Worldwide.

WHEN: Wednesday, November 5, 2008 at 1:00PM

WHERE: 6th Annual SoC Conference, Radisson Hotel, Newport Beach, CA For more information, please go to: www.SoCconference.com

WHO: eSilicon, a leading Value Chain Producer (VCP) for the semiconductor industry, provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume chip production. The company delivers custom chips (ASICs) to system OEMs and fabless semiconductor companies who serve a wide variety of markets including the consumer, computer, communications and industrial segments. For more information, please go to www.esilicon.com.

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