Webinar Video: 10-Minute GDSII Tapeout Quotes

Re-play of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal.  Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes.  We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.

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TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

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Instant MPW Quotes: New Die Packaging Services

Request a free account and explore your multi-project wafer (MPW) production options with no obligation. Our newest MPW quoting tool includes standard IC package options.
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Events

SMIC 2014 Technology Symposium Shanghai

SMIC 2014 Technology Symposium Shanghai

On September 18, 2014  |  Shanghai , China
TSMC 2014 Open Innovation Platform (OIP) Ecosystem Forum

TSMC 2014 Open Innovation Platform (OIP) Ecosystem Forum

On September 30, 2014  |  San Jose, CA
MemCon 2014

MemCon 2014

On October 15, 2014  |  Santa Clara, California
International Wafer-Level Packaging Conference (IWLPC)

International Wafer-Level Packaging Conference (IWLPC)

From November 11, 2014 Until November 13, 2014  |  San Jose, CA
GSA Awards Dinner Celebration 2014

GSA Awards Dinner Celebration 2014

On December 11, 2014  |  Santa Clara, California
CSIA-ICCAD 2014

CSIA-ICCAD 2014

From December 11, 2014 Until December 12, 2014  |  New Territories, Hong Kon