What is IC Design Virtualization?

Find out more with our IC design virtualization white paper series:

  • Design Virtualization and Its Impact on SoC Design

  • Design Virtualization Technology for Low-Power ASICs


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IP Catalog

Our complete portfolio of customizable semiconductor IP and I/Os is available at

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Please contact us to schedule a demo of eSilicon Access® production management tracking software.


How We Deliver First-Time-Right ASICS

Infrastructure & Processes

Our infrastructure integrates your core competencies with our design, productization and manufacturing services and the global semiconductor value chain. Our infrastructure includes the eSilicon® STAR Tracker: Real-time design progress and IC delivery tracking, including order history, forecasts and yield data. STAR Tracker links customers electronically to eSilicon’s global supply chain so you can efficiently monitor and manage project details. Tracker integrates customer order information with work-in-process (WIP) production data, refreshed multiple times daily.


eSilicon partners with key suppliers in the areas of semiconductor IP and manufacturing, including foundries, packaging and test houses. These partnerships enable a seamless flow from concept to volume ASIC production.

First-Time-Right ASICs: Infrastructure, Processes and Partners

At eSilicon, we excel in consistently providing first-time-right silicon to our customers. This is no small task. We are able to achieve this for a variety of reasons.

Our intelligent infrastructure is the backbone that provides the essential ingredients for our success. It spans all aspects of chip design — foundry technology characteristics, IP models, package information, test platforms, and quality and reliability data. We work with tier-one partners in each of these areas, distil the raw information they provide us, and maintain an intelligent database that enables us to make quick decisions and evaluate tradeoffs objectively.

This intelligent infrastructure system is coupled to our unique design methodology, where we address design elements — from RTL to GDSII, package design, test program development, and quality and reliability assessment — using a combination of commercial tools and proprietary eSilicon tools. Our rigorous methodology provides well-defined handoffs between each step in the process for a smooth transition from design to manufacturing.

Finally, our connection to manufacturing data — the eSilicon STAR Tracker production management system— provides us the continuous feedback and learning mechanism that allows us to monitor our process and meet specific customer requirements.

Our track record speaks for itself. With over 275 tapeouts since eSilicon’s inception, our first-time-success rate is greater than 99 percent.