First-Time-Right ASICs: Infrastructure, Processes and Partners
At eSilicon, we excel in consistently providing first-time-right silicon to our customers. This is no small task. We are able to achieve this for a variety of reasons.
Our Intelligent Infrastructure is the backbone that provides the essential ingredients for our success. It spans all aspects of chip design — foundry technology characteristics, IP models, package information, test platforms, and quality and reliability data. We work with tier-one partners in each of these areas, distil the raw information they provide us, and maintain an intelligent database that enables us to make quick decisions and evaluate tradeoffs objectively.
This Intelligent Infrastructure system is coupled to our eSiFlow™ design methodology, where we address design elements — from RTL to GDSII, package design, test program development, and quality and reliability assessment — using a combination of commercial tools and proprietary eSilicon tools. Our rigorous methodology provides well-defined handoffs between each step in the process for a smooth transition from design to manufacturing.
Finally, our connection to manufacturing data — the eSilicon Access® production management system— provides us the continuous feedback and learning mechanism that allows us to monitor our process and meet specific customer requirements.
Our track record speaks for itself. With over 200 tapeouts since eSilicon’s inception, our first-time-success rate is greater than 99 percent.
eSiFlow ASIC Design Methodology and Intelligent Infrastructure System