Webinar Video: 10-Minute GDSII Tapeout Quotes

Re-play of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal.  Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes.  We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.


TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

Request a copy of this application note by email.


Instant MPW Quotes: New Die Packaging Services

Request a free account and explore your multi-project wafer (MPW) production options with no obligation. Our newest MPW quoting tool includes standard IC package options.
MPW shuttle service details>>>

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In the News 2014

August 11, 2014

IWLPC 2014 To Feature 3D InCites Panel: System-level Advantages of 3D Integration
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August 7, 2014

When Will 2.5D Cut Costs?
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Changing the IP Supplier Paradigm
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August 1, 2014

eSilicon and the Ten Minute Quote

July 30, 2014

Blog Review: July 30
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July 28, 2014

Fabulous Fabless: Nenni & McLellan offer cure for common clutter
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July 26, 2014

Getting a Tapeout Quote in 10 Minutes

July 24, 2014

2.5/3D IC — Do We Have Liftoff?
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IP Integration Challenges Rising
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EDA's Hedge Plays
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New Winners And Losers
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Foundries Versus OSATs
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July 22, 2014

Semiconductor leaders talk about industry's future
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July 18, 2014

eSilicon and IDT Collaborate on Next-generation RapidIO Switches

July 2, 2014

Blog Review: July 2
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July 1, 2014

Having the Courage to Design in 3D TSVs
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June 28, 2014

Join eSilicon and SemiWiki for a webinar demonstrating eSilicon's new automated GDSII quoting tool

This is How We Get One Million Design Starts

June 27, 2014

The Week In Review: Design
eSilicon uncorked a GDSII online quote system for TSMC

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June 26, 2014

Semiconductor Self-Service: The Next Wave
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Moore's Law Tail No Longer Wagging The Dog
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Semiconductor R&D Crisis Ahead
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eSilicon: Jack Harding unplugged
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June 17, 2014

DAC 2014 IP Talks! Lisa Minwell, eSilicon
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June 10, 2014

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June 6, 2014

eSilicon to cut costs of ASIC development for IoT, other markets
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The Design Automation Conference Returns to the City by the Bay

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June 5, 2014

The Best and Worst of #51DAC

June 4, 2014

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June 1, 2014

Fabless Book Giveaway at the #51DAC Network Reception

May 31, 2014

The Silicon ATM

DAC is Next Week!

May 23, 2014

Self-Service Comparisons Come To SoC Design
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May 22, 2014

New Business Model: Flexible Silos
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May 21, 2014

DAC panels tackle giga-scale design challenges, semiconductor market in China
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May 16, 2014

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May 8, 2014

IP To Meet 2.5D Requirements
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May 7, 2014

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May 4, 2014

The Number One ASIC Racing Team!

April 24, 2014

The Fading Art of Person-to-Person Communication
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April 23, 2014

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April 22, 2014

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April 18, 2014

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EUV Slips a Year Per Year...Or More

April 10, 2014


April 8, 2014

ST pursues the wider option when it comes to supply voltage for future transistors
New Electronics

IP Reuse and Management in Monterey

April 2, 2014

2.5D/3D packaging panel at the GSA Silicon Summit
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March 31, 2014

eSilicon on Semiconductor IP Challenges

March 28, 2014

New Product Introduction Process for Heterogeneous 2.5D Devices
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New Approaches For Reliability
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March 27, 2014

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IP Challenges, FinFET, 3D-IC, and FD-SOI Updates

How Much Will That Chip Cost?
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March 17, 2014

GSA Silicon Summit is on April 10th

March 16, 2014

Cadence is all about Semiconductor IP!

March 7, 2014

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February 27, 2014

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February 25, 2014

Getting an MPW Quote on My iPhone

February 18, 2014

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February 10, 2014

Blog Review: Grand prizes in Paris design; variability pitfalls; snap happy; volume vs. innovation: Waste Not, Want Not (for Innovation)
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February 7, 2014

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February 6, 2014

Tech Talk: The New Cost Per Gate Equation
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January 30, 2014

Ticket to Ride
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January 27, 2014

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January 22, 2014

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January 16, 2014

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January 6, 2014
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