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TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

Request a copy of this application note by email.


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In the News 2014

April 8, 2014

ST pursues the wider option when it comes to supply voltage for future transistors
New Electronics

April 2, 2014

2.5D/3D packaging panel at the GSA Silicon Summit
Silicon Semiconductor

March 31, 2014

eSilicon on Semiconductor IP Challenges

GSA Announces 2014 Board of Directors Election Results

March 28, 2014

New Product Introduction Process for Heterogeneous 2.5D Devices
By Javier DeLaCruz, eSilicon senior director of engineering
GSA Forum Magazine

New Approaches For Reliability
Semiconductor Engineering

March 27, 2014

Self-Service Semiconductors
By Mike Gianfagna, eSilicon VP, marketing
Semiconductor Engineering

IP Challenges, FinFET, 3D-IC, and FD-SOI Updates

How Much Will That Chip Cost?
Semiconductor Engineering

March 17, 2014

GSA Silicon Summit is on April 10th

March 16, 2014

Cadence is all about Semiconductor IP!

March 7, 2014

Making Progress with 3D IC Design and Test

February 27, 2014

GSA (1994-2014) - 20 Years of Industry Collaboration: Collaboration and Community
GSA YouTube Channel

Evolution vs. Revolution
Semiconductor Engineering

February 25, 2014

Getting an MPW Quote on My iPhone

February 18, 2014

Quoting Automatically the eSilicon Way

February 10, 2014

Blog Review: Grand prizes in Paris design; variability pitfalls; snap happy; volume vs. innovation: Waste Not, Want Not (for Innovation)
By Jack Harding, eSilicon CEO
Chip Design Magazine

February 7, 2014

Week In Review: eSilicon added package services to its automated online quote system for multi-project wafer shuttles
Semiconductor Engineering

February 6, 2014

Tech Talk: The New Cost Per Gate Equation
Video presentation by Javier DeLaCruz, eSilicon senior director of engineering
Semiconductor Engineering

January 30, 2014

Ticket to Ride
By Mike Gianfagna, eSilicon VP of Marketing
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The Growing Verification Challenge
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January 27, 2014

Experts At The Table: Yield And Reliability Issues With Integrating IP
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Predictions 2014 — eSilicon's Mike Gianfagna on IP Integration for 2014
EDA Café

January 22, 2014

Just Released! Fabless: The Transformation of the Semiconductor Industry

January 16, 2014

The Road Ahead For 2014
Semiconductor Engineering

January 6, 2014
Experts at the Table: What's Next?
Part 1 | Part 2| Part 3
Semiconductor Engineering