Big Data, the Cloud and the Internet of (Silicon) Things

Semiconductor Industry Survey


We want to know what you think, to better understand your needs and ensure that our Big Data, Cloud and Internet of (Silicon) Things strategies are aligned.


The survey takes 5-10 minutes to complete.

Take our confidential survey on Survey Monkey >>>

Survey

Webinar Video: 10-Minute GDSII Tapeout Quotes

Re-play of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal.  Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes.  We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.

View

TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

Request a copy of this application note by email.

Request

Instant MPW Quotes: New Die Packaging Services

Request a free account and explore your multi-project wafer (MPW) production options with no obligation. Our newest MPW quoting tool includes standard IC package options.
MPW shuttle service details>>>

Sign Up

See Our Complete
IP Catalog

Our complete portfolio of customizable semiconductor IP and I/Os is available at ChipEstimate.com.

In the News 2014

September 10, 2014

What’s eSilicon Up To Now?
SemiWiki

August 31, 2014

eSilicon Industry Survey:
Big Data, the Cloud and the Internet of (Silicon) Things

SemiWiki

August 29, 2014

Changing The IP Supplier Paradigm: Part 2
Semiconductor Engineering

August 21, 2014

Looking For The Next Big Thing
Semiconductor Engineering

The Changing IP Ecosystem
Semiconductor Engineering

More Than Moore
Semiconductor Engineering

Different Approaches Emerge For Stacking Die
Semiconductor Engineering

August 12, 2014

White Paper: Quantifying Entitlement for 14/16nm Technologies
By Lisa Minwell, eSilicon Senior Director, IP Marketing
ChipEstimate

August 11, 2014

IWLPC 2014 To Feature 3D InCites Panel: System-level Advantages of 3D Integration
3D Incites

August 7, 2014

When Will 2.5D Cut Costs?
Semiconductor Engineering

Changing the IP Supplier Paradigm
Semiconductor Engineering

August 1, 2014

eSilicon and the Ten Minute Quote
SemiWiki

July 30, 2014

Blog Review: July 30
Semiconductor Engineering

July 28, 2014

Fabulous Fabless: Nenni & McLellan offer cure for common clutter
EDA Cafe

July 26, 2014

Getting a Tapeout Quote in 10 Minutes
SemiWiki

July 24, 2014

2.5/3D IC — Do We Have Liftoff?
By Mike Gianfagna, eSilicon VP, marketing
Semiconductor Engineering

IP Integration Challenges Rising
Semiconductor Engineering

EDA's Hedge Plays
Semiconductor Engineering

New Winners And Losers
Semiconductor Engineering

Foundries Versus OSATs
Semiconductor Engineering

July 22, 2014

Semiconductor leaders talk about industry's future
EE Times India

July 18, 2014

eSilicon and IDT Collaborate on Next-generation RapidIO Switches
SemiWiki

July 2, 2014

Blog Review: July 2
Semiconductor Engineering

July 1, 2014

Having the Courage to Design in 3D TSVs
3D Incites

June 28, 2014

Join eSilicon and SemiWiki for a webinar demonstrating eSilicon's new automated GDSII quoting tool
SemiWiki

This is How We Get One Million Design Starts
SemiWiki

June 27, 2014

The Week In Review: Design
eSilicon uncorked a GDSII online quote system for TSMC

Semiconductor Engineering

June 26, 2014

Semiconductor Self-Service: The Next Wave
By Mike Gianfagna, eSilicon VP, marketing
Semiconductor Engineering

Moore's Law Tail No Longer Wagging The Dog
Semiconductor Engineering

Can EDA Keep Growing?
Semiconductor Engineering

Experts at the Table: Tougher Memory Choices
Part 1 | Part 2
Semiconductor Engineering

Semiconductor R&D Crisis Ahead
Semiconductor Engineering

June 19, 2014

eSilicon: Jack Harding unplugged
EDA Cafe

June 17, 2014

DAC 2014 IP Talks! Lisa Minwell, eSilicon
YouTube video
ChipEstimate

June 12, 2014

GDS II Online for TSMC
SemiWiki

June 11, 2014

Blog Review: Phil Kaufman Hall of Fame?
By Jack Harding, eSilicon CEO
Semiconductor Engineering

June 10, 2014

Know Cost & Options Before You Design SoC
eSilicon brings e-commerce to chip designers

EE Times

June 6, 2014

eSilicon to cut costs of ASIC development for IoT, other markets
Tech Design Forum

Baby Got DAC
The Design Automation Conference Returns to the City by the Bay

EE Journal

June 5, 2014

The Best and Worst of #51DAC
SemiWiki

June 4, 2014

2014 DAC Interviews: Mike Gianfagna, VP Marketing, eSilicon
Video
EDA Cafe

June 1, 2014

Fabless Book Giveaway at the #51DAC Network Reception
SemiWiki

May 31, 2014

The Silicon ATM
SemiWiki

DAC is Next Week!
SemiWiki

May 23, 2014

Self-Service Comparisons Come To SoC Design
Semiconductor Engineering

May 22, 2014

New Business Model: Flexible Silos
Semiconductor Engineering

Big Memory Shift Ahead
Semiconductor Engineering

May 21, 2014

DAC panels tackle giga-scale design challenges, semiconductor market in China
Solid State Technology

May 16, 2014

eSilicon @ #51 DAC—Why is a Chip Company at DAC?
SemiWiki

May 8, 2014

IP To Meet 2.5D Requirements
Semiconductor Engineering

May 7, 2014

Powerful Memories
Semiconductor Engineering

May 4, 2014

The Number One ASIC Racing Team!
SemiWiki

April 24, 2014

The Fading Art of Person-to-Person Communication
By Mike Gianfagna, eSilicon VP, marketing
Semiconductor Engineering

Efficiency Metrics Get Fuzzy
Semiconductor Engineering

SoC Assembly And IP Reuse
Semiconductor Engineering

April 23, 2014

How To Improve The Profitability Of Fabless Semiconductor Companies
Semiconductor Engineering

April 22, 2014

IP the eSilicon Way
SemiWiki

April 18, 2014

Improving Yield Of 2.5D Designs
Semiconductor Engineering

EUV Slips a Year Per Year...Or More
SemiWiki

April 10, 2014

GSA 3DIC
SemiWiki

April 8, 2014

ST pursues the wider option when it comes to supply voltage for future transistors
New Electronics

IP Reuse and Management in Monterey
SemiWiki

April 2, 2014

2.5D/3D packaging panel at the GSA Silicon Summit
Silicon Semiconductor

March 31, 2014

eSilicon on Semiconductor IP Challenges
SemiWiki

March 28, 2014

New Product Introduction Process for Heterogeneous 2.5D Devices
By Javier DeLaCruz, eSilicon senior director of engineering
GSA Forum Magazine

New Approaches For Reliability
Semiconductor Engineering

March 27, 2014

Self-Service Semiconductors
By Mike Gianfagna, eSilicon VP, marketing
Semiconductor Engineering

IP Challenges, FinFET, 3D-IC, and FD-SOI Updates
SemiWiki

How Much Will That Chip Cost?
Semiconductor Engineering

March 17, 2014

GSA Silicon Summit is on April 10th
SemiWiki

March 16, 2014

Cadence is all about Semiconductor IP!
SemiWiki

March 7, 2014

Making Progress with 3D IC Design and Test
3DInCites

February 27, 2014

GSA (1994-2014) - 20 Years of Industry Collaboration: Collaboration and Community
Video
GSA YouTube Channel

Evolution vs. Revolution
Semiconductor Engineering

February 25, 2014

Getting an MPW Quote on My iPhone
SemiWiki

February 18, 2014

Quoting Automatically the eSilicon Way
SemiWiki

February 10, 2014

Blog Review: Grand prizes in Paris design; variability pitfalls; snap happy; volume vs. innovation: Waste Not, Want Not (for Innovation)
By Jack Harding, eSilicon CEO
Chip Design Magazine

February 7, 2014

Week In Review: eSilicon added package services to its automated online quote system for multi-project wafer shuttles
Semiconductor Engineering

February 6, 2014

Tech Talk: The New Cost Per Gate Equation
Video presentation by Javier DeLaCruz, eSilicon senior director of engineering
Semiconductor Engineering

January 30, 2014

Ticket to Ride
By Mike Gianfagna, eSilicon VP of Marketing
Semiconductor Engineering

The Growing Verification Challenge
Semiconductor Engineering

January 27, 2014

Experts At The Table: Yield And Reliability Issues With Integrating IP
Semiconductor Engineering

Predictions 2014 — eSilicon's Mike Gianfagna on IP Integration for 2014
EDA Café

January 22, 2014

Just Released! Fabless: The Transformation of the Semiconductor Industry
SemiWiki

January 16, 2014

The Road Ahead For 2014
Semiconductor Engineering

January 6, 2014
Experts at the Table: What's Next?
Part 1 | Part 2| Part 3
Semiconductor Engineering