GDS II Handoff
Our GDSII handoff solution enables your company to more easily adopt a customer-owned tooling (COT) model without the cost and overhead required to develop your internal manufacturing operations. Your company manages the chip design and delivers a GDSII layout; eSilicon manages the fabrication, packaging, test and delivery of your custom chip.
We also offer a full suite of value-added manufacturing engineering services, including package selection and design, and new product qualification and characterization.
Our manufacturing services leverage our long-standing relationships with TSMC as the prime supplier for wafers, and multiple high-quality partners to address the wide range of package and test requirements for your chip design. Our production support includes production management, ongoing yield enhancement, value chain management and audit.
With our GDSII engagement solution, you get all the services of our Netlist handoff that you want, without the physical design, test strategy and development and test program development.
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