Services

eSilicon services

At eSilicon, all we do is custom chips, so our core competencies are devoted to our singular mission.  Our design, productization and manufacturing services – backed by our patented eSilicon Enterprise™ infrastructure – give you a flexible, low-cost and lower-risk way to achieve silicon.

Our design services include:

  • Physical implementation: place & route, timing analysis, extraction, verification and DRC
  • DFT / DFM: testability analysis, test development and manufacturing process analysis
  • Package design: custom package design, thermal analysis and chip / package interface simulation

Our productization services include:

  • Device qualification: custom qualification programs, stress and life testing
  • Fast / slow device characterization
  • Yield ramp: test data analysis and process tuning

Our manufacturing services include:

  • Long-standing relationship with TSMC, enabling unparalleled manufacturing services
  • Multiple suppliers to address standard and custom package needs
  • Relationships with both domestic and offshore testing facilities for complete support of your chip requirements