Services
At eSilicon, our only focus is to provide leading-edge ASIC services and solutions; as a result, our company's core competencies are devoted to reflect this singular mission. Our IC design services, productization and manufacturing – backed by the patented eSilicon Enterprise™ infrastructure – provides a flexible, low-cost and lower-risk method to achieve right-first-time silicon.
ASIC design services include:
- Physical implementation: place & route, timing analysis, extraction, verification and DRC
- DFT / DFM: testability analysis, test development and manufacturing process analysis
- Package design: custom package design, thermal analysis and chip / package interface simulation
ASIC productization services include:
- Device qualification: custom qualification programs, stress and life testing
- Fast / slow device characterization
- Yield ramp: test data analysis and process tuning
ASIC manufacturing services include:
- Long-standing relationship with TSMC, enabling unparalleled manufacturing services
- Multiple suppliers to address standard and custom package needs
- Relationships with both domestic and offshore testing facilities for complete support of your chip requirements
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