Services
At eSilicon, all we do is custom chips, so our core competencies are devoted to our singular mission. Our design, productization and manufacturing services – backed by our patented eSilicon Enterprise™ infrastructure – give you a flexible, low-cost and lower-risk way to achieve silicon.
Our design services include:
- Physical implementation: place & route, timing analysis, extraction, verification and DRC
- DFT / DFM: testability analysis, test development and manufacturing process analysis
- Package design: custom package design, thermal analysis and chip / package interface simulation
Our productization services include:
- Device qualification: custom qualification programs, stress and life testing
- Fast / slow device characterization
- Yield ramp: test data analysis and process tuning
Our manufacturing services include:
- Long-standing relationship with TSMC, enabling unparalleled manufacturing services
- Multiple suppliers to address standard and custom package needs
- Relationships with both domestic and offshore testing facilities for complete support of your chip requirements