Productization
eSilicon's productization services address our customers’ device-specific qualification, stress test, life test, test coverage analysis, device characterization across the full range of process parameters, process tuning and yield ramp along with package, test and production support. In order to address these requirements, eSilicon recognizes the need for relationships with top-tier partners in these areas.
Strategic Relationships:
As a larger percentage of ICs are fabricated by "pure-play" foundries, a commensurate percentage of ICs need to be packaged and tested by third-party service companies.
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