Webinar Video: 10-Minute GDSII Tapeout Quotes

Re-play of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal.  Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes.  We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.

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TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

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Instant MPW Quotes: New Die Packaging Services

Request a free account and explore your multi-project wafer (MPW) production options with no obligation. Our newest MPW quoting tool includes standard IC package options.
MPW shuttle service details>>>

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See Our Complete
IP Catalog

Our complete portfolio of customizable semiconductor IP and I/Os is available at ChipEstimate.com.

Duy-Loan Le Joins eSilicon Board

SUNNYVALE, Calif. — October 23, 2012 — eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced the addition of Duy-Loan Le, senior fellow at Texas Instruments (TI), to its board of directors.

“We are honored to welcome Duy-Loan to our board,” said Jack Harding, eSilicon’s president and CEO. “She brings a global, technical perspective to the board through both her professional life at TI and her philanthropic work in furthering education in the U.S. and Vietnam.

“eSilicon has an innovative, evolving business model that meets the changing needs of the semiconductor industry,” said Ms. Le. “As we start to work in the newest process nodes, design complexities are increasing to a point where even large companies are reaching out for help. It’s a pleasure to join eSilicon’s board during such an exciting time.”

Ms. Le is a senior fellow at TI. She is responsible for technology readiness and operational execution for TI’s multi-billion dollar embedded processing business. Ms. Le started her career with TI over 25 years ago as a memory design engineer. She has held multiple leadership roles within the company and was the first woman elected to senior fellow status.

Ms. Le serves on the boards of National Instruments and the Mona Foundation, the engineering advisory board for the University of Texas’ Cockrell College of Engineering, and the executive board for the University of Houston’s Bauer College of Business. She is a founding member and advisory board director for the Sunflower Mission, which provides educational opportunities in her native Vietnam.

Ms. Le is a registered professional engineer and holds over 20 patents. She holds a Bachelor of Science in Electrical Engineering from the University of Texas at Austin and an MBA from the University of Houston.

About eSilicon
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com.

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eSilicon Corporation
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