Webinar Video: 10-Minute GDSII Tapeout Quotes

Replay of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal.  Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes.  We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.

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TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

Request a copy of this application note by email.

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Instant MPW Quotes: New Die Packaging Services

Request a free account and explore your multi-project wafer (MPW) production options with no obligation. Our newest MPW quoting tool includes standard IC package options.
MPW shuttle service details>>>

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eSilicon adds IP to its suite of online SoC automation tools

IP MarketPlace™ environment facilitates exploration of eSilicon memory IP

SAN JOSE, Calif. — May 23, 2014 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced the expansion of its online automation suite with the addition of the IP MarketPlace™ environment, which provides interactive exploration of eSilicon-designed compilable memories. eSilicon will demonstrate this new capability at the 51st Design Automation Conference (DAC), to be held at the Moscone Convention Center in San Francisco, California, June 2 to June 4, 2014.

The IP MarketPlace environment provides the ability to explore the complete product line of compilable memories from eSilicon. Through an intuitive, easy-to-use interface, various memory configurations may be browsed to determine the best power, performance or area (PPA) fit for a particular system-on-chip (SoC) design. Microsoft Excel summaries of PPA performance of the chosen memories can then be downloaded for further analysis, along with datasheets and IP silicon reports.

"Memories are now a very large portion of all SoCs, typically accounting for 50 percent or more of the chip," said Patrick Soheili, vice president and general manager, IP Solutions at eSilicon. "eSilicon's suite of compilable memories can significantly improve the PPA result for many designs. The IP MarketPlace environment will make those PPA savings easier to access for a wide range of customers."

eSilicon will be demonstrating the IP MarketPlace environment in booth 512 at DAC. You can find more information about eSilicon's other DAC activities here.

Availability
The IP MarketPlace environment will be available for general customer use in the fall of 2014. Access will be through eSilicon's public website. Please click here if you would like to be notified when the IP MarketPlace environment is publicly available.

About eSilicon
eSilicon, a leading independent semiconductor design and manufacturing solutions provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com.

eSilicon — Enabling Your Silicon Success™

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eSilicon is a registered trademark, and the eSilicon logo, Enabling Your Silicon Success and IP MarketPlace are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

Media Contacts
Sally Slemons
eSilicon Corporation
408.635.6409
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Susan Cain
Cain Communications
408.393.4794
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