Packaging Services

Sophisticated Packaging Expertise

Packaging expertise at eSilicon covers many disciplines, from the traditional to 2.5D and 3D. We take a holistic approach to package selection, identifying the solutions best suited for a given application. The considerations made at the very beginning of a project include the following:

  • Signal count/type
  • Signal integrity
    • Power delivery
    • Isolation/crosstalk
    • Signal transition
    • Electromagnetic interface (EMI)
  • PCB routing options
  • Space requirements
  • Cost considerations
  • Thermal considerations
  • Volume vs. assembly source
  • Reliability considerations

Various FBGA Configurations


Signal Integrity Team

Our signal integrity team is not as an afterthought of the design process. Instead, signal integrity at the die, package and system levels is considered up front. Our team is a scalable extension of your own and we can either complement your own capabilities or add capabilities in complex electrical performance modeling. Rules of thumb may be a good starting point, but we do not rely on these to determine the outcome. Before a part is ever constructed, we can work with you to determine what services make the most sense for a given application and what needs to be done to overcome any performance concerns you may have.

Our team can help indentify the right approach and provide the Touchstone or Wideband SPICE models you may need for your own system work or downstream customer requirements. We can also perform simulation work at the system level for your application bring-up board including a socket, connectors, external components and the device under test.