Webinar: 10-Minute GDSII Tapeout Quotes

Join eSilicon and SemiWiki for a webinar demonstrating eSilicon's new automated GDSII quoting tool.
July 31, 2014, 8:00 AM PDT.
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TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

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Instant MPW Quotes: New Die Packaging Services

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Package Matters, by Javier DeLaCruz, eSilicon's manufacturing technology director, covers hot topics in semiconductor packaging such as 3D-IC and 2.5D-IC packaging technology, thru-silicon-vias (TSVs), the relative cost of multi-chip modules (MCMs), and considerations for choosing the lowest-cost package for your ASIC. [Read More]

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ASIC design involves the complex interaction of foundry process technology, IP design and integration, EDA tools and design methodologies, physical design, design for test, package design and product engineering. We focus on optimizing for the combination of power, performance, and area (PPA) appropriate for your device's specific targets.

  • We have access to the leading foundry process technologies to 14/16nm through our partnerships with the world's leading-edge foundries.
  • In addition to our vast third-party IP portfolio — including IP from ARM, Avago Technologies, Imagination Technologies, Northwest Logic, Synopsys and True Circuits — we provide custom logic, memory, analog and I/O solutions to meet your specific needs, be they targeted for high performance or low power.
  • Our unique PPA-optimized design methodology is targeted to provide the best power, performance and area for your ASIC.

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Close collaboration between our design, test, package, and process engineering teams results in a smooth transition of our designs to manufacture so that your design is testable and manufacturable with high yield. Our extensive experience with this holistic approach to ASIC design has yielded a proven track record of first-time-right designs and provides you with a quality ASIC solution and low total cost of ownership.

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