Diffusion, Via and Contact ROM Memory Compilers
eSilicon has designed diffusion, via and contact ROM memory compilers catering to a wide variety of customers, including integrated device manufacturers (IDMs), foundries and fabless semiconductor companies (FSCs).
High-Reliability ROMs for Automotive
Automotive application customers have long relied on eSilicon’s high-reliability ROMs for Level 0 automotive applications. eSilicon has developed a custom low-leakage bit cell that has been used in ROMs targeting automotive applications. These ROMs are functional at high temperatures such as 175° C and have enabled our automotive application customers to create significant competitive advantages.
Low-Power, High-Performance, Ultra-High Density ROMs for Wireless and Handheld
Wireless and handheld customers have partnered with eSilicon for multiple generations to develop
- Low–power, high-density ROM memory compilers that can meet the low battery life requirements of wireless and handheld devices, while at the same time deliver ultra-high density
- Low–power, high-performance ROM memory compilers that can meet the low battery life requirements of wireless and handheld devices, while at the same time deliver the performance required by state-of-the-art devices such as smart phones
eSilicon’s philosophy for developing ROM memory compilers is to customize the memories to end-customer requirements. This usually involves turning on multiple knobs to tune the area, power, performance of ROMs per customer application requirements. The chart below shows some of the elements that eSilicon has successfully used in the past to meet customer targets.
Area
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Performance
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Power Management
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Testability
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- Aspect Ratio
- Side Decode
- Push-Rule Bit Cell
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- Low Vt for Highest Performance
- Banking
- Center Decode
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- DVFS
- Mixed Vt Periphery
- High Vt Periphery
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- BIST Mux
- Scan Flops
- Read Stress
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if you would like to learn more about our custom IP offering.