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TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

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White Paper

High-Performance Classification Using Embedded Ternary Content Addressable Memory (TCAM)

With port speeds exceeding 100Gbps, route lookups that are a fundamental application to all routers have relied on ternary content addressable memories (TCAM) to provide a lookup response within a clock cycle. However, these devices in “discrete form” suffer from limitations in terms of power, cost and real estate and to some extent lack the required flexibility. Embedding a TCAM block along with the rest of the system in a single device should overcome these disadvantages. This paper provides an overview of advantages of embedded TCAMs and describes a few applications that could take advantage of embedded TCAM technology. [View more white papers]

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IP Catalog

Our complete portfolio of customizable semiconductor IP and I/Os is available at ChipEstimate.com.

Custom Embedded IP Brochures

eFlexCAM™ Custom Embedded
CAM Compilers

Binary and Ternary CAM (BCAM and TCAM) compilers in 28nm-180nm.

eFlex™ Custom Embedded
Memory IP

SRAM, ROM, MPRF, CAM, and cache custom memories.

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Diffusion, Via and Contact ROM Memory Compilers

eSilicon has designed diffusion, via and contact ROM memory compilers catering to a wide variety of customers, including integrated device manufacturers (IDMs), foundries and fabless semiconductor companies (FSCs).

High-Reliability ROMs for Automotive

Automotive application customers have long relied on eSilicon’s high-reliability ROMs for Level 0 automotive applications. eSilicon has developed a custom low-leakage bit cell that has been used in ROMs targeting automotive applications. These ROMs are functional at high temperatures such as 175° C and have enabled our automotive application customers to create significant competitive advantages.

Low-Power, High-Performance, Ultra-High Density ROMs for Wireless and Handheld

Wireless and handheld customers have partnered with eSilicon for multiple generations to develop

  • Low–power, high-density ROM memory compilers that can meet the low battery life requirements of wireless and handheld devices, while at the same time deliver ultra-high density
  • Low–power, high-performance ROM memory compilers that can meet the low battery life requirements of wireless and handheld devices, while at the same time deliver the performance required by state-of-the-art devices such as smart phones

eSilicon’s philosophy for developing ROM memory compilers is to customize the memories to end-customer requirements. This usually involves turning on multiple knobs to tune the area, power, performance of ROMs per customer application requirements. The chart below shows some of the elements that eSilicon has successfully used in the past to meet customer targets.



Power Management


  • Aspect Ratio
  • Side Decode
  • Push-Rule Bit Cell
  • Low Vt for Highest Performance
  • Banking
  • Center Decode
  • DVFS
  • Mixed Vt Periphery
  • High Vt Periphery
  • BIST Mux
  • Scan Flops
  • Read Stress

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