ASIC Productization

Our team uses eSilicon's well-defined processes and infrastructure to manage your design from product development to volume production release so that your product is built to meet your and your end customers' requirements. The process starts pre-tapeout with package selection, tester selection, and characterization and qualification planning.

Our services include:

• Package layout
• Test plan development
• Test hardware development (probe cards, load boards, contactors and handler kits)
• Test pattern conversion
• Test program bring-up
• Prototype unit coordination and delivery

eSilicon specializes in characterization and qualification. For every chip, we put together a characterization plan and a qualification plan to baseline the yield, help build the device data sheet, and meet customers’ product quality requirements.

eSilicon has expertise on the full spectrum of package types, from 24-pin QFN to 16-layer flip-chip devices. We work with a broad range of foundries and process nodes using test platforms covering digital and mixed signal devices. We have experience running qualification for many different types of devices and end markets.