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Package Matters, by Javier DeLaCruz, eSilicon's manufacturing technology director, covers hot topics in semiconductor packaging such as 3D-IC and 2.5D-IC packaging technology, thru-silicon-vias (TSVs), the relative cost of multi-chip modules (MCMs), and considerations for choosing the lowest-cost package for your ASIC. [Read More]

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White Paper

Strategies to Prevent IC Failures in Volume Production

When IC devices are produced and shipped to end customers, it is important that they will function as specified in the application environment. This paper outlines strategies and practices used to statistically sample, and predict how a device will operate over time. The practices outlined are believed to be best in class techniques for a successful product launch. These strategies most likely will point to sensitivities in devices that cause intermittent failures or process weaknesses which cause hard failures. If all of the outlined methods are not done in the preproduction phase, it may be necessary for failures to be analyzed later to prevent such occurrences in the future. [View more white papers]

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Quality

Quality Policy

eSilicon is committed to complete customer satisfaction through compliance with our customers’ specifications and continual improvement. We strive to deliver our products and services on time, at competitive costs, with operational and manufacturing excellence.

Quality Management System

Our quality management system (QMS) supports many different market segments, product technologies and customer requirements. eSilicon has a flexible business model to support our customers, which is easily enabled by the processes we have implemented. Customer service is our priority and we take pride in producing high-quality deliverables to meet customer expectations with a high level of customer satisfaction.

Infrastructure

eSilicon’s documentation and quality management infrastructure supports complex products. Tier-one customers have successfully audited and qualified our design and manufacturing systems. Our closed-loop system and validation efforts produce repeatable manufacturing results, which can significantly reduce customer issues or manufacturing defects. Our supplier management process can effectively identify process issues and deficiencies in systems prior to production volume ramps.

Process & Systems

eSilicon has developed a comprehensive system to organize and track all customers, products and environmental variants; it provides a secure and accurate representation of customer and product requirements. Our supplier arrangements support a streamlined manufacturing process, delivering a reliable, high-quality outcome for fab, assembly and test operations.

Reliability & Failure Analysis

Reliability is one of our key customer support strengths: our ability to design, manufacture and implement complicated qualification programs for customers not only creates a win-win scenario for our customers, but also allows for reliable products to be shipped into the field.

Reliability Services

  • High-temperature operating life (HTOL)
  • Preconditioning per JEDEC-A113, all levels
  • Temperature-humidity bias testing
  • Highly accelerated stress bias testing (HAST)
  • Temperature cycling
  • High-temperature storage
  • Low-temperature burn-in
  • Thermal shock
  • Autoclave (pressure cooker) testing
  • High-power burn-in
  • ESD/latch-up for high pin-count devices
  • Other services available upon request

Failure Analysis Services

  • I/V characterization (curve trace)
  • Microprobing
  • Picoprobing up to 3 GHz
  • Optical microscopic examination
  • Chemical or mechanical decapsulation
  • Real time X-ray
  • Scanning acoustic microscopy (C-SAM)
  • Scanning electron microscopy (SEM) systems
  • Energy dispersive X-ray analysis (EDX)
  • Emission microscopy
  • Hot-spot analysis
  • Chemical deprocessing
  • Plasma etching
  • Parallel lapping
  • Cross sectioning
  • Ball shear / bond pull
  • Failure analysis reports
  • Other services available upon request

ISO 9001:2008 Certification

eSilicon is ISO 9001:2008 Management System Standard certified by Det Norske Veritas (DNV). eSilicon’s U.S. and Romania facilities were audited and passed in September 2012. In 2013, we plan to have our Asia facilities audited. Click here to view the ISO 9001 certificate.

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