Our flexible engagement model allows customers to hand off their design at a variety of levels — or engage strictly for custom memory IP. OEMs typically engage at the RTL or netlist level, while fabless semiconductor companies (FSCs) typically engage at the GDSII handoff or production level.
Whichever path you choose, we’ve built a proven system to take your design to volume production.
Our team uses eSilicon’s well-defined processes and infrastructure to manage your design from product development to volume production release so that your product is built to meet your requirements. The process starts pre-tapeout with package selection, tester selection, and characterization and qualification planning.
Our productization services include:
From the very beginning, eSilicon has focused on automating many of its business processes. Whether it involves manufacturing logistics, ASIC quote generation, IP sales or design optimization, we have built an extensive and sophisticated automation backbone for every task. The result is higher predictability, improved accuracy and substantial improvements in enterprise efficiency.
Through our eSilicon® STAR platform, we’re now making this sophisticated automation available to all customers worldwide through the internet. The technology behind all the STAR platform tools has seen years of use inside eSilicon. It’s now time for our customers to enjoy the same benefits that we have seen.