eSilicon addresses the $10B+ custom chip opportunity of fabless semiconductor companies and system OEMs across a broad range of markets. Applications include TCP/IP offload engines and security co-processors, digital audio/MP3 players, digital cameras and printers, home gateways and routers, and next-generation storage networking solutions.
Driven by the explosion of broadband, the communications market demands ultra-high-performance processing. The ability to develop efficient and reliable high-speed transceivers that match critical timing requirements is essential. eSilicon applies strong skills in high-speed communications, with significant experience in advanced I/O and SerDes technologies. Our special expertise in custom package design complements these skills, enabling co-design of the die, package and PCB to optimize system performance.
The consumer market is not only one of the fastest growing segments in the semiconductor industry, it's also one of the fastest moving. To meet tight market windows, companies require access to proven application-specific IP, a fast ramp to production, and low costs to drive volume. eSilicon's rich portfolio of IP, strong expertise in IP integration, and first-time silicon success provide customers with a rapid path to market. And our strong supply chain relationships, concentrated purchasing power, and aggressive yield optimization programs deliver cost-effective manufacturing solutions for high volume products.
The digital imaging market has shifted into high gear, as digital cameras, camera cell-phones, and printers have all incorporated color imaging. Rapid advances in resolution technologies require high performance processing, with access to DSPs, PLLs and memory controllers to manage the growth in megapixels. As an ARM-certified ATAP partner, eSilicon's delivers expertise in integrating high-performance DSP technology with IP and custom logic, delivering first-time silicon success. Our ability to provide cost-effective manufacturing solutions helps customers reach the price-points needed to achieve higher volumes in end markets.
As the networking market shifts into multi-Gigabit data rates, a variety of standards remains in widespread use, creating a highly diverse equipment environment. Customers require chips that meet significant challenges in interoperability and standards compliance. Meanwhile, cost considerations drive customers towards higher levels of integration. eSilicon provides strong SoC design and IP integration capabilities to deliver complex chips that support multiple data rates and communications standards. And eSilicon's expertise in custom package design for communications ensures that the chip will operate as designed in the system.
The increasing threats posed by viruses, malware, and network intrusion fuel a fast-growing market for chips that enhance security. Customers require chips in servers and routers that deliver high performance to offload CPUs with encryption, data inspection, and increasingly, application-layer support. eSilicon provides system architecture and design expertise for high performance and distributed processing applications, with a smooth path to volume production.
Whether SAN or NAS, the storage market has shifted to networked storage, and parallel buses have been replaced by high-speed serial alternatives such as SATA and SAS. Customers in these markets have perhaps the highest complexity challenges: compliance with multiple networking and storage standards, as well as high-speed serial communications. eSilicon meets this challenge with in-house expertise in networking, SerDes and high-speed communications, and Fibre Channel technologies. eSilicon integrates this knowledge with a proven methodology for massive hierarchical designs to deliver highly complex chips that work the first time.
Driven by the rapid growth of WiFi and the impending shift to WiMax, wireless has established itself as a standard capability for communications and networking, from LANs to PANs. Customers must balance low-power with performance and support a wide variety of interfaces. eSilicon provides a complete and low-risk solution by combining three essential components: low-power wireless IP that is silicon-proven; cost-effective access to DSP and micro-controller cores along with a broad range of interface IP; and special expertise in complex IP integration for first-time silicon success.
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