Webinar: 10-Minute GDSII Tapeout Quotes

Join eSilicon and SemiWiki for a webinar demonstrating eSilicon's new automated GDSII quoting tool.
July 31, 2014, 8:00 AM PDT.
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TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

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Instant MPW Quotes: New Die Packaging Services

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Package Matters, by Javier DeLaCruz, eSilicon's manufacturing technology director, covers hot topics in semiconductor packaging such as 3D-IC and 2.5D-IC packaging technology, thru-silicon-vias (TSVs), the relative cost of multi-chip modules (MCMs), and considerations for choosing the lowest-cost package for your ASIC. [Read More]

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We have a rich heritage in designing ASICs in leading-edge technologies. We have maintained this strong expertise at eSilicon since its inception, where we have a proven track record of first-time-right silicon. Our engineers are well known in the industry, having published many articles, papers and textbooks in the area of ASIC design. Our unique ASIC design methodology supports consistency across design teams who are supported by subject-matter experts. This allows you to focus on your design, not on what could go wrong.