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Package Matters, by Javier DeLaCruz, eSilicon's manufacturing technology director, covers hot topics in semiconductor packaging such as 3D-IC and 2.5D-IC packaging technology, thru-silicon-vias (TSVs), the relative cost of multi-chip modules (MCMs), and considerations for choosing the lowest-cost package for your ASIC. [Read More]

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Home WHY Design

ASIC Design Expertise

We have a rich heritage in designing ASICs in leading-edge technologies. We have maintained this strong expertise at eSilicon since its inception, where we have a proven track record of first-time-right silicon. Our engineers are well known in the industry, having published many articles, papers and textbooks in the area of ASIC design. Our unique ASIC design methodology supports consistency across design teams who are supported by subject-matter experts. This allows you to focus on your design, not on what could go wrong.