High-Performance Comms Webinar Video Now Available
AI Hardware Summit at the Computer History Museum
OFC Demo Video: 7nm 56G SerDes Over 5-Meter Cable
Media Coverage
How to Transform Innovative Technologies Into Customer-Specific Solutions
Since 1980 I have observed how our industry has improved key parameters like cost per function, power dissipation, form factor, complexity and clock speed by many orders of magnitude. By Herb Reiter 3DInCites
eSilicon Brings a New Software Interface to its 7nm neuASIC Machine Learning Platform at Hot Chips
AI Accelerator software maps high-level AI workloads expressed in languages such as TensorFlow to the neuASIC machine learning platform and does a quick PPA estimate. By Randy Smith SemiWiki
Improving 2.5D Packaging Design Flow: A Brief History
The increasing demands of 2.5D packaging technology are driving the need for a more advanced and integrated 2.5D packaging design solution. By Tony Mastroianni, eSilicon Senior Director, Packaging Design Chip Scale Review
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Upcoming Events
Hot Chips 2019: A Symposium on High-Performance Chips
August 18-20 | Palo Alto, CaliforniaSince it started in 1989, Hot Chips has been known as one of the...
AI Hardware Summit USA 2019
September 18-19 | Mountain View, CaliforniaThe AI Hardware Summit USA is the first and only conference dedicated solely...
