OFC Demo Video: 7nm HBM2 PHY at 2.4Gbps
Full DSP SerDes Demos: Linley Spring Processor Conference
OFC Demo Video: 7nm 56G SerDes Over 5-Meter Cable
Media Coverage
Nguồn nhân lực số tương lai: Những gợi mở và cơ hội trong ngành STEM
Ngoài ra, trong khuôn khổ STEMCON 2019, còn có các hoạt động triển lãm sản phẩm khoa học - công nghệ; trao Giải thưởng Pearson về Đổi mới Phương pháp Giảng dạy cho Giảng viên; Học bổng cho Nữ Sinh viên trong ngành STEM của eSilicon. The Future Digital Workforce: Implications and Opportunities in STEM In addition, within the framework of STEMCON 2019, there are also exhibitions of scientific and technological products; the Pearson Award for Innovation in Teaching Methods for Teachers; and the eSilicon Scholarship for Female Students in the STEM industry. Dantri
Using Less Power At The Same Node
When going to a smaller node is no longer an option, how do you get better power performance? Several techniques are possible. By Brian Bailey Semiconductor Engineering
3D InCites community awards Mentor, a Siemens Business “EDA Provider of the Year” for 3rd consecutive year!
Every year, 3D InCites recognizes company and individual contributions to the development of the heterogeneous roadmap, including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration, via their 3D InCites awards program. Mentor IC Design Blog
Recent News
OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth
Upcoming Events
Linley Spring Processor Conference 2019
April 10-11 | Santa Clara, CaliforniaThe Linley Spring Processor Conference 2019 is the only one of its kind focused...
Hot Chips 2019: A Symposium on High-Performance Chips
August 18-20, 2019 | Palo Alto, CaliforniaSince it started in 1989, Hot Chips has been known as one of the...
