COLLABORATE. DIFFERENTIATE. WIN.
How we do it
Part 2: For the semiconductor IP industry to remain healthy it has to constantly innovate, but it’s getting harder.
These are ASICs, so who is sourcing the design? You need to look at who is really good at 2.5D integration and who owns the critical enabling IP for these designs (think the HBM2 physical interface and high-speed SerDes).
Unique machine learning algorithms, diminished benefits from scaling, and a need for more granularity are creating a boom for accelerators.
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eSilicon at DAC 2017
High-performance, high-bandwidth IP platform for Samsung 14LPP process technology
Silicon-proven HBM Gen2 Hardened PHY from eSilicon
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The TSMC Open Innovation Platform (OIP) Ecosystem Forum is a one-of-a-kind...
The GSA U.S. Executive Forum is an invitation-only event that brings together...
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