Big Data, Big Opportunities
By Jens Andersen on June 25, 2015 from
For the last two decades I have spent a lot of my time managing operations and sales for several EDA startups, most of which were acquired. The focus of many of these companies was to provide solutions to optimize complex designs. We worked to enhance many of the top 25 semiconductor companies’ ... continue reading
What a Large ASIC Should Look Like in a Couple of Years
By eSilicon on October 30, 2012 from
... and it looks nothing like today's large ASICs
The current state of the art
For years, large ASICs like the ones used in network processing, supercomputing and high-end personal computing have had very interesting similarities. The figure below is a fairly typical floorplan of such an ... continue reading
Which Companies Will Be the Drivers of Thru-Silicon-Via (TSV) Packaging Technology?
By eSilicon on March 05, 2012 from
There are two general flavors of 3D-TSV technology. Images for these can be seen in the previous blog entry "The Future of ASICs in 3D."
3D-IC has vias in silicon containing active circuitry.
2.5D is similar, but uses passive silicon, glass or organic interposers to enable very fine pitch ... continue reading
The Future of ASICs in 3D
By eSilicon on May 12, 2011 from
3D technology is generating a lot of interest as a way to reduce NRE costs and speed time to market. It is in its nascency so people are looking for a single standard in through-silicon vias (TSVs). This is mainly for reducing infrastructure costs. Unfortunately, I do not think this will be the ... continue reading