Robotics Comes to eSilicon Software Quality Assurance
By Nam To Hoang on May 08, 2016 from
In today´s fast-moving and rapidly changing world, it is a challenge for any company to continuously maintain and improve the quality and efficiency of software systems development.
The main goal of the software development processes is a timely release, because time is money — time is ... continue reading
Big Data, Big Opportunities
By Sally Slemons on June 25, 2015 from
For the last two decades I have spent a lot of my time managing operations and sales for several EDA startups, most of which were acquired. The focus of many of these companies was to provide solutions to optimize complex designs. We worked to enhance many of the top 25 semiconductor companies’ ... continue reading
What a Large ASIC Should Look Like in a Couple of Years
By Sally Slemons on October 30, 2012 from
... and it looks nothing like today's large ASICs
The current state of the art
For years, large ASICs like the ones used in network processing, supercomputing and high-end personal computing have had very interesting similarities. The figure below is a fairly typical floorplan of such an ... continue reading
Which Companies Will Be the Drivers of Thru-Silicon-Via (TSV) Packaging Technology?
By Sally Slemons on March 05, 2012 from
There are two general flavors of 3D-TSV technology. Images for these can be seen in the previous blog entry "The Future of ASICs in 3D."
3D-IC has vias in silicon containing active circuitry.
2.5D is similar, but uses passive silicon, glass or organic interposers to enable very fine pitch ... continue reading