Advanced ASICs are a Team Sport
By Mike Gianfagna on February 23, 2017 from
The recent Super Bowl proved that a team with conviction and focus can do anything. This notion comes in handy when you think about the nearly impossible job of designing and manufacturing an advanced ASIC – in FinFET technologies, with an interposer, and multiple die, and never-before-proven ... continue reading
Silicon Valley Repackaged
By Jack Harding on November 08, 2012 from
No technology remains forever. The venerable buggy whip gave way to other forms of vehicular acceleration. Similarly, the very fabric and namesake of Silicon Valley may be under assault.
One of the few technical tenets of the semiconductor industry that has crossed over into mainstream ... continue reading
What a Large ASIC Should Look Like in a Couple of Years
By Sally Slemons on October 30, 2012 from
... and it looks nothing like today's large ASICs
The current state of the art
For years, large ASICs like the ones used in network processing, supercomputing and high-end personal computing have had very interesting similarities. The figure below is a fairly typical floorplan of such an ... continue reading
Which Companies Will Be the Drivers of Thru-Silicon-Via (TSV) Packaging Technology?
By Sally Slemons on March 05, 2012 from
There are two general flavors of 3D-TSV technology. Images for these can be seen in the previous blog entry "The Future of ASICs in 3D."
3D-IC has vias in silicon containing active circuitry.
2.5D is similar, but uses passive silicon, glass or organic interposers to enable very fine pitch ... continue reading