The Future of ASICs in 3D

By Sally Slemons on May 12, 2011 from

3D technology is generating a lot of interest as a way to reduce NRE costs and speed time to market. It is in its nascency so people are looking for a single standard in through-silicon vias (TSVs). This is mainly for reducing infrastructure costs. Unfortunately, I do not think this will be the ... continue reading

To SoC or SiP?

By Jack Harding on April 21, 2010 from

IP reusability has been a drumbeat in the semiconductor industry for a dozen years or more.  The thesis is simple: why build again what you already have?  And with most durable, simple statements, the foundation is one of profundity. The basic need has yielded breakthrough innovation from IP ... continue reading

TSV’s: ready for primetime?

By Sally Slemons on January 22, 2010 from

TSV's (through-silicon-vias) are vias through a silicon die that allow for connections to pass to and from the active side of the die to the backside.  These have the potential to really change ... continue reading