Which Companies Will Be the Drivers of Thru-Silicon-Via (TSV) Packaging Technology?
By Sally Slemons on March 05, 2012 from
There are two general flavors of 3D-TSV technology. Images for these can be seen in the previous blog entry "The Future of ASICs in 3D."
3D-IC has vias in silicon containing active circuitry.
2.5D is similar, but uses passive silicon, glass or organic interposers to enable very fine pitch ... continue reading
The Future of ASICs in 3D
By Sally Slemons on May 12, 2011 from
3D technology is generating a lot of interest as a way to reduce NRE costs and speed time to market. It is in its nascency so people are looking for a single standard in through-silicon vias (TSVs). This is mainly for reducing infrastructure costs. Unfortunately, I do not think this will be the ... continue reading
Thru-Silicon Vias, Current State of the Technology
By Sally Slemons on January 30, 2011 from
Ready for primetime in ASICs...almost
Thru-silicon-vias (TSVs) have become a very hot topic in in recent months. Ever since Xilinx reported that they are using a 2.5D ... continue reading
To SoC or SiP?
By Jack Harding on April 21, 2010 from
IP reusability has been a drumbeat in the semiconductor industry for a dozen years or more. The thesis is simple: why build again what you already have? And with most durable, simple statements, the foundation is one of profundity.
The basic need has yielded breakthrough innovation from IP ... continue reading