The future of ASICS in AI/deep learning, networking, high-performance computing and 5G

What’s Next?

By Mike Gianfagna on December 21, 2017 from

We just concluded two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D ... continue reading