What a Large ASIC Should Look Like in a Couple of Years
By Sally Slemons on October 30, 2012 from
... and it looks nothing like today's large ASICs
The current state of the art
For years, large ASICs like the ones used in network processing, supercomputing and high-end personal computing have had very interesting similarities. The figure below is a fairly typical floorplan of such an ... continue reading
Thru-Silicon Vias, Current State of the Technology
By Sally Slemons on January 30, 2011 from
Ready for primetime in ASICs...almost
Thru-silicon-vias (TSVs) have become a very hot topic in in recent months. Ever since Xilinx reported that they are using a 2.5D ... continue reading
The Turning Point… Can MCM’s Be Less Expensive Than Single Die Solutions?
By Sally Slemons on December 30, 2010 from
In the epic battle of cost and performance, MCM's (multi-chip modules) had generally lost to SoC's (system on chips) due to higher package assembly costs and lower performance. The tides are turning. Several factors have been in play in recently:
Package assembly costs of MCM's have been ... continue reading
TSV’s: ready for primetime?
By Sally Slemons on January 22, 2010 from
TSV's (through-silicon-vias) are vias through a silicon die that allow for connections to pass to and from the active side of the die to the backside. These have the potential to really change ... continue reading