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Hot Chips 2018: A Symposium on High-Performance Chips

August 19-21, 2018 | Cupertino, California

Since it started in 1989, Hot Chips has been known as one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August in the center of the world’s capital of electronics activity, Silicon Valley.

The Hot Chips conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits.

neuASIC 7nm Platform for Machine Learning ASIC Design

Stop by eSilicon’s table next to the poster displays to hear the latest on our 7nm neuASIC™ platform for machine learning ASIC design. Through customized, targeted 7nm FinFET IP and a modular design methodology, the neuASIC platform removes the restrictions imposed by changing AI algorithms. The platform includes a library of AI-targeted functions that can be quickly combined and configured to create custom AI algorithm accelerators. With the use of a Design Profiler and AI Engine Explorer, eSilicon-developed and third-party IP can be configured as AI “tiles” via an ASIC Chassis Builder, allowing early power, performance and area (PPA) analysis of various candidate architectures.