Hot Chips 2019: A Symposium on High-Performance Chips
August 18-20 | Palo Alto, California
Since it started in 1989, Hot Chips has been known as one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August in the center of the world’s capital of electronics activity, Silicon Valley. Hot Chips 2019 will be held at Stanford University in Palo Alto, California.
eSilicon at Hot Chips 2019
Update on Chiplets
The idea of chiplets makes sense in terms of yield, cost and risk, but they haven’t really caught on. Is there a chiplet business model that works?
Introducing AI Accelerator Software
eSilicon’s 7nm FinFET neuASIC™ AI IP platform is a library of AI-specific tiles that can be configured to support an AI algorithm. eSilicon’s new AI Accelerator maps high-level AI workloads to the neuASIC platform and estimates PPA (power, performance, area) for the algorithm in the resultant silicon implementation.
neuASIC IP plus the AI Accelerator software allow design exploration of candidate architectures to ensure the design will be within the target specifications. This approach supports changes to the algorithm or the package.
eSilicon will be demonstrating AI Accelerator on Monday and Tuesday at its sponsor table.
AI Accelerator is available in IP Navigator, eSilicon’s IP exploration and evaluation tool, at no charge. A free eSilicon STAR account is required to access Navigator, which may be requested here.
When & Where
Sunday-Tuesday, August 18-20, 2019
Memorial Auditorium, Stanford Campus
Palo Alto, California
Registration for the conference is still open online or on site during the event at the registration booth.
If you want to learn more about our neuASIC AI chip platform before Hot Chips 2019 in August, please contact email@example.com.