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ISSCC 2019

February 17-21 | San Francisco, California

The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency and to network with leading experts.

eSilicon at ISSCC 2019

Monday, February 18
2:30 PM
Session 6.3
A Sub-250mW 1-to-56Gb/s Continuous-Range PAM-4 42.5dB IL ADC/DAC-Based Transceiver in 7nm FinFET
The eSilicon SerDes team will present this paper and demonstrate the 7nm 56Gb/s SerDes

By M. Pisati, F. De Bernardinis, P. Pascale, C. Nani, M. Sosio, E. Pozzati, N. Ghittori, F. Magni, M. Garampazzi, G. Bollati, A. Milani, A. Minuti, F. Giunco, P. Uggetti, I. Fabiano, N. Codega, A. Bosi, N. Carta, D. Pellicone, G. Spelgatti, M. Cutrupi, A. Rossini, R. Massolini, G. Cesura,  and I. Bietti
eSilicon Italy
Pavia, Italy

Session 6: Ultra-High-Speed Wireline
Session Chair: Tony Chan Carusone, University of Toronto, Toronto, Canada
Associate Chair: Takayuki Shibasaki, Fujitsu Laboratories, Kawasaki, Japan

ISSCC 2019 Advance Program PDF