Live Seminar & Networking Event: A Complete 14nm 2.5D, HBM2, SerDes ASIC Solution
December 11, Tokyo | December 14, Shanghai
During this live seminar, we will introduce a complete ecosystem to deliver cutting-edge ASICs and 2.5D/HBM2 systems to support the development of applications in the high-performance computing, networking, deep learning and 5G markets. Join us for an informative and interactive series of discussions. Explore the capabilities of our fully integrated supply chain that can help you realize your product vision with advanced FinFET ASIC and packaging technology, IP, design and production capabilities. Real case studies and future plans will be also discussed.
Join Samsung Electronics, ASE Group, eSilicon, Rambus and Northwest Logic for an overview of the advanced technologies being used to develop ASICs for high-performance applications. We’ll discuss HBM2 technology and the associated PHY, high-speed SerDes, 2.5D integration, high-performance ASIC design, interposer/package design and the manufacturing and packaging technologies available to address this class of FinFET-based designs.
This live, in-person event is free. Seating is limited, please register today.
Monday, 11 December 2017
Tokyo Conference Center Shinagawa
Thursday, 14 December 2017
Kerry Hotel, Pudong, Shanghai
Registration closes at 18:00 on 5 December 2017. For security reasons, only those who have pre-registered may attend.
10:30 Arrival, registration and networking
11:00 Samsung, HBM2 memory solutions
11:30 Samsung, foundry solutions including 14nm FinFET
12:00 ASE Group, advanced 2.5D packaging
12:30 Hosted lunch
13:30 eSilicon, ASIC & 2.5D design & implementation, HBM2 PHY, high-speed memories
14:00 Rambus, high-performance SerDes
14:30 Northwest Logic, HBM2 controller
15:00 Hosted networking cocktail reception and lucky draws