OFC 2019 56G SerDes demo

OFC 2019

March 3-7, 2019 | San Diego, California

The Optical Networking and Communication Conference & Exhibition (OFC) is the largest global conference and exhibition for optical communications and networking professionals.

eSilicon at OFC 2019: Booth 5416

SerDes secrets revealed in private presentations

eSilicon will provide a deep dive into our 56G full DSP 7nm SerDes in private meetings at OFC 2019. Please contact or drop by booth 5416 to schedule a meeting.

Live demos: 7nm 56G full DSP long-reach SerDes

Using Samtec ExaMAX™ Backplane Connector paddle cards and a five-meter ExaMAX Backplane Cable Assembly, eSilicon will demonstrate the performance, flexibility and extremely low power consumption of its 7nm, 56G PAM4 and NRZ DSP-based long-reach SerDes.

The demonstration will drive eight high-speed SerDes lanes in three configurations:

  • PAM4 modulation with point-to-point links
  • NRZ modulation with point-to-point links
  • PAM4 modulation with double-length (10 meter) loop-back links with repeater

All channels will be run at different speeds to showcase the flexibility of the SerDes device. Real-time data associated with all channels will also be displayed to demonstrate the robustness and low power of the device, including:

  • Voltage histograms, pre- and post-DSP
  • Signal-to-noise ratio
  • Equalization
  • Eye diagrams
  • Error rate plots

Live demos: 2.4Gbps HBM2 PHY subsystem for high-performance computing, networking & AI

This demonstration shows a complete high-bandwidth memory Gen2 (HBM2) solution in 7nm operating at 2.4Gbps.

  • The subsystem includes:
    • eSilicon’s latest 7nm HBM2 PHY
    • Northwest Logic memory controller
    • HBM DRAM stack from a leading memory supplier
  • The test chip uses leading-edge interposer technology to interconnect the integrated PHY and controller with the 3D DRAM stack
  • The firmware, combined with a user-friendly graphical interface (GUI), allows test and validation of the HBM subsystem
  • Among other tests and monitoring tools available, this board demonstrates the link margin of the complete subsystem with the internal eye monitor and schmoo

HBM2 PHY benefits include:

  • Fully hardened 7nm HBM2 PHY for easy integration
  • Production-ready design available for licensing: first 7nm product already taped out
  • Fifth generation of HBM PHYs proven in silicon
  • Interposer design available for faster time to market
  • Maximum data rate supported across all timing corners
  • HBM2E at 3.2Gbps in development
  • Full productization support available: signal integrity, power integrity and thermal analysis

The 56G SerDes and HBM2 PHY are part of eSilicon’s complete, highly configurable, FinFET-class 7nm networking IP platform.