Start Your HBM/2.5D Design Today: Live Webinar

March 29, 2016 | Online
SK hynix, Inc., Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High Bandwidth Memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack. Many companies are already using HBM to create very high-bandwidth, low-power products. This webinar will present a complete HBM supply chain that is delivering and supporting customer HBM designs now.

Webinar attendees will also receive a white paper on the development and implementation of HBM designs.

Tuesday, March 29, 2016
8:00 AM & 6:00 PM
Pacific daylight time

Agenda Speaker
3D memory stack Kevin Tran, Senior Manager, Technical Marketing
Interposer & assembly Paul Silvestri, Director of TSV Product Development
2.5D package, silicon die & HBM PHY Bill Isaacson, Director, ASIC Product Marketing
HBM controller Brian Daellenbach, President
System verification & optimization Chris Browy, Senior VP, WW Sales and Marketing