Press Releases
May 10, 2019
ESD Alliance CEO Outlook 2019: eSilicon CEO Jack Harding to Participate
May 9, 2019
eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip
May 8, 2019
Samsung Foundry Forum 2019: eSilicon to unveil 14nm switching and 5G infrastructure ASICs
May 7, 2019
eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip
May 1, 2019
eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC
April 30, 2019
eSilicon Expands Technical Advisory Board
April 29, 2019
eSilicon Signs Multi-Year Agreement with Google Cloud
April 2, 2019
Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
April 2, 2019
eSilicon to present at State of AI and ML – Spring 2019
March 29, 2019
eSilicon awards six scholarships to top female STEM students at STEMCON Vietnam 2019
March 20, 2019
DATE 2019: eSilicon to present two papers on advanced floor planning techniques in conjunction with the Polytechnic University of Catalonia
March 12, 2019
OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth
March 5, 2019
Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC
February 26, 2019
OFC 2019: eSilicon to demonstrate two 7nm IP products, 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem
February 13, 2019
领先的FinFET ASIC供应商eSilicon 的最新势态
February 13, 2019
eSilicon builds momentum as a strong tier one FinFET ASIC supplier
February 11, 2019
ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
January 30, 2019
eSilicon and Wild River Technology Announce Advanced SerDes Test System
January 29, 2019
eSilicon Announces Technical Advisory Board
January 23, 2019
DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly
