November 13, 2019 SC19: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Five-Meter Samtec Cable Assembly
September 23, 2019 eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
September 17, 2019 ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Five-Meter Samtec Cable Assemblies
September 12, 2019 AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable
June 20, 2019 eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar
June 6, 2019 eSilicon to Participate in Panel Discussion on Chiplet Design Experience at a Workshop Presented by the Open Compute Project (OCP)
May 8, 2019 Samsung Foundry Forum 2019: eSilicon to unveil 14nm switching and 5G infrastructure ASICs
April 2, 2019 Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
March 20, 2019 DATE 2019: eSilicon to present two papers on advanced floor planning techniques in conjunction with the Polytechnic University of Catalonia
March 12, 2019 OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth
February 26, 2019 OFC 2019: eSilicon to demonstrate two 7nm IP products, 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem
February 11, 2019 ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
January 23, 2019 DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly