Press Releases
November 11, 2019
eSilicon to be Acquired by Inphi and Synopsys
September 23, 2019
eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
September 17, 2019
ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Five-Meter Samtec Cable Assemblies
September 12, 2019
AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable
August 14, 2019
eSilicon to debut AI Accelerator software and a new chiplet model at Hot Chips 2019
June 20, 2019
eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar
June 6, 2019
eSilicon to Participate in Panel Discussion on Chiplet Design Experience at a Workshop Presented by the Open Compute Project (OCP)
May 28, 2019
Google and eSilicon at DAC 2019: Doing EDA in the Cloud? Yes, It’s Possible!
May 24, 2019
eSilicon Technical Advisory Board Members Win Facebook Research Award
May 14, 2019
eSilicon Announces Production Qualification of 5G Infrastructure ASIC
May 10, 2019
ESD Alliance CEO Outlook 2019: eSilicon CEO Jack Harding to Participate
May 9, 2019
eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip
May 8, 2019
Samsung Foundry Forum 2019: eSilicon to unveil 14nm switching and 5G infrastructure ASICs
May 7, 2019
eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip
May 1, 2019
eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC
April 30, 2019
eSilicon Expands Technical Advisory Board
April 29, 2019
eSilicon Signs Multi-Year Agreement with Google Cloud
April 2, 2019
Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
April 2, 2019
eSilicon to present at State of AI and ML – Spring 2019
March 29, 2019
eSilicon awards six scholarships to top female STEM students at STEMCON Vietnam 2019
March 20, 2019
DATE 2019: eSilicon to present two papers on advanced floor planning techniques in conjunction with the Polytechnic University of Catalonia
March 12, 2019
OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth
March 5, 2019
Interoperability demo at OFC: eSilicon 56G SerDes and Precise-ITC 400G FEC
February 26, 2019
OFC 2019: eSilicon to demonstrate two 7nm IP products, 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem
February 13, 2019
领先的FinFET ASIC供应商eSilicon 的最新势态
February 13, 2019
eSilicon builds momentum as a strong tier one FinFET ASIC supplier
February 11, 2019
ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
January 30, 2019
eSilicon and Wild River Technology Announce Advanced SerDes Test System
January 29, 2019
eSilicon Announces Technical Advisory Board
January 23, 2019
DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly
