Press Releases
September 18, 2018
eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design
September 18, 2018
eSilicon to present power optimization paper at SNUG Singapore, September 21, 2018
September 13, 2018
eSilicon Announces Silicon Validation of 7nm 56G SerDes
September 6, 2018
eSilicon at the AI Hardware Summit, September 18-19, 2018
August 15, 2018
eSilicon to exhibit at Hot Chips 2018: A Symposium on High-Performance Chips, Cupertino, California, August 19-21
August 14, 2018
The Linley Group Microprocessor Report Details eSilicon 7nm IP
August 7, 2018
eSilicon licenses industry-leading SiFive E2 Core IP for next-generation SerDes IP
July 26, 2018
eSilicon to present Mastering SI/PI for Advanced Package Design at the ANSYS Innovation Conference, Santa Clara, California
July 23, 2018
22 students graduate eSilicon’s FAST Academy work-study program
June 26, 2018
7nm networking platform delivers unprecedented performance and configurability for data center ASICs
June 19, 2018
eSilicon at DAC: eSilicon announces new networking platform
June 5, 2018
eSilicon revolutionizes machine learning ASIC platform (MLAP) market
May 1, 2018
eSilicon deep learning ASIC in production qualification
April 4, 2018
eSilicon trao tặng 07 học bổng cho Nữ sinh hàng đầu khối ngành STEM tại Việt Nam
April 4, 2018
eSilicon awards seven scholarships to top female STEM students in Vietnam
April 3, 2018
ASICs Unlock Deep Learning Innovation: Webinar May 2, 2018
March 27, 2018
eSilicon to present: Enabling Technology for the Cloud and AI – One Size Fits All?
February 13, 2018
ASICs Unlock Deep Learning Innovation: Live Seminar in Silicon Valley
January 22, 2018
TIRIAS research publishes white paper on ASIC market
January 10, 2018
14nm FinFET 2.5D/HBM2/SerDes Webinar, presented by Samsung, ASE, eSilicon, Rambus and Northwest Logic
January 9, 2018
eSilicon announces 7nm FinFET ASIC design win
