Samsung Foundry Forum 2019: eSilicon to unveil 14nm switching and 5G infrastructure ASICs
For release on May 8, 2019, San Jose, Calif.
eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will discuss its 14nm switching/5G infrastructure chips and 14nm IP platform at the Samsung Foundry Forum 2019 in Santa Clara, California.
At the fourth annual Samsung Foundry Forum in Santa Clara, California, Samsung Foundry and industry experts will share their latest innovations in process technology, packaging technology, IP and design solutions, and design services.
eSilicon at the Samsung Foundry Forum
14nm switching/5G ASICS and IP platform
eSilicon’s 14nm switching and 5G infrastructure ASICs are moving into production. We will present highlights of these designs and our 14nm IP platform at the networking reception in the Samsung Partner Pavilion, 5:30-7:00 PM.
May 14, 2019
1:00-2:00 Check In
2:00-2:35 Welcome & Keynotes
2:35-3:25 Session 1: Technology & Innovation
3:40-4:10 Session 2: Foundry Platform Solutions
4:10-5:20 Session 3: Customer Panel
5:20-5:30 Closing Remarks
5:30-7:00 Networking Reception
Santa Clara Marriott
Santa Clara, California
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com
Collaborate. Differentiate. Win.™
eSilicon is a registered trademark, and the eSilicon logo, neuASIC and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.
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