eSilicon CEO Jack Harding: Building Complex, FinFET-Class ASICs
Designing, developing & manufacturing a FinFET ASIC requires a new model. Customer collaboration is critical for ASIC success
Fast Cars and Fast Chips
Why competitive racing is like building a complex custom chip.
eSilicon Navigator Webinar – Browse and Buy Semiconductor IP Online
Learn how to use Navigator to explore eSilicon high-performance, high-bandwidth memory IP and 2.5D/HBM2 on Samsung 14LPP FinFET technology: TCAM, HBM2 PHY, extended-voltage GPIO (EVGPIO) and more.
TSMC OIP 2016: ChipEstimate.com interviews Lisa Minwell, eSilicon
ChipEstimate.com interviews Lisa Minwell on the 2.5D/HBM ecosystem