Brochures

Brochures

Title File size Last modified
FinFET ASIC Design & Manufacturing Services

eSilicon manages the design, development and manufacturing of highly complex FinFET ASICs for our customers—system OEMs in networking, computing, artificial intelligence (AI) and 5G infrastructure. To meet the demands of building these monster ASICs, we have created a new model for taking our ASIC customers from RTL to volume production: transparent, collaborative, flexible. We call it the coASIC model.


302.73 KB July 10, 2017
eSilicon’s Networking-Centric 14LPP IP Platform

eSilicon has complete physical IP and 2.5D high-bandwidth memory (HBM2) solutions on Samsung 14LPP technology, including high-performance, high-bandwidth networking-centric memory compilers, TCAM, HBM2 PHY and extended-voltage GPIO (EVGPIO). For complete data sheets and silicon results, contact sales@esilicon.com or log on to IP Navigator at https://star.esilicon.com.


565.65 KB March 15, 2017
eSilicon HBM Gen2 Hardened PHY Solutions on Samsung 14LPP, TSMC 16FF+ and TSMC 28HPC

eSilicon has a complete 2.5D/HBM (high-bandwidth memory) solution: 2.5D ecosystem management, HBM Gen2 PHY, ASIC, interposer and package design through manufacturing. This brochure gives an overview of our HBM Gen2 hardened PHY solutions on Samsung 14LPP, TSMC 16FF+ and TSMC 28HPC. Contact ipbu@esilicon.com for our full HBM Gen2 PHY data sheet.


436.52 KB December 8, 2016
eFlexCAM Custom Embedded Ternary CAM Compilers

Silicon-proven 14/16nm-180nm custom ternary and binary content-addressable memory (TCAM and BCAM) compilers let you choose and compile features to optimize ASIC power, performance or area.


448.08 KB October 24, 2016
eFlex Custom Embedded Memory IP

eSilicon custom memory IP can optimize an ASIC design for power, performance, or area (PPA) to deliver the right chip at the right price for your market.


801.95 KB October 24, 2016