eSilicon started the MoZAIC™ “Modular Z-axis Integrated Circuit” Program in 2011. As an ASIC provider for large, complex networking and communication systems, we began analyzing new approaches that would provide more bandwidth for our customers.
This includes the development of an HBM PHY in 28nm and FinFET technologies as well as the study of 2.5D packaging. eSilicon has completed seven test chips to date that verify the HBM PHY IP and assemble a supply chain in support of 2.5D integration — design, verification, test and reliability.
eSilicon has multiple 14/16nm FinFET 2.5D ASICs in design, with several entering production in the first half of 2017.
|HBM ASIC With Silicon Interposer 2015||HBM FPGA With Organic Interposer 2012|
eSilicon also develops a hardened HBM PHY, catering to a wide variety of customers and market segments from 28nm to 10nm. Through our partnership with Northwest Logic, we offer a comprehensive HBM interface including both the controller and the PHY, which is silicon validated in an integrated system that includes the interposer and DRAM stack.
Please contact us at email@example.com for HBM Gen1 and HBM Gen2 data sheets and other technical documentation or if you would like to learn more about our IP and I/O offerings.
eSilicon is connected to all levels of the semiconductor manufacturing supply chain: fabs, test and assembly companies, EDA companies and design houses. If you are interested in doing your first 2.5D or 3D project, we can help you make the right decisions. eSilicon will manage the entire supply chain using the fabs and assembly and test houses that are ready for 2.5D and 3D ICs.