eSilicon has been in the forefront of 2.5D technology for years. Our first high-bandwidth memory 1 (HBM1) connected devices were assembled in 2013 and we have been active in the space since then with organic interposer technology, silicon interposer technology, non-interposer-based technologies and the IP needed to enable this technology.
eSilicon started the MoZAIC™ program (Modular Z-Axis Integrated Circuit) in 2011, focused on enabling the IP, design capability, packaging and test methodologies and supply chain needed to ensure the lowest-risk, highest-performance device development.
|HBM ASIC With Silicon Interposer 2015||HBM FPGA With Organic Interposer 2012|
eSilicon also develops HBM Gen1 and HBM Gen2 PHY, DLL and I/O libraries, catering to a wide variety of customers and market segments from 28nm to 14nm/16nm. Our HBM Gen2 I/O library includes support for programmable driver strengths, embedded ESD/Decaps, internal programmable VREF generators, receiver power-down modes and can support up to 2Gb/s data rate with clock speeds of up to 1GHz.
Please contact us at email@example.com for HBM Gen1 and HBM Gen2 data sheets and other technical documentation or if you would like to learn more about our IP and I/O offerings.
eSilicon is connected to all levels of the semiconductor manufacturing supply chain: fabs, test and assembly companies, EDA companies and design houses. If you are interested in doing your first 2.5D or 3D project, we can help you make the right decisions. eSilicon will manage the entire supply chain using the fabs and assembly and test houses that are ready for 2.5D and 3D-ICs. eSilicon is already active in 2.5D and expects to be an early adopter of production-ready 3D technology.