Custom 2.5D & 3D Packaging

Custom 2.5D & 3D Packaging

Custom 2.5D Packaging

eSilicon has been in the forefront of 2.5D technology for years. Our first HBM1 connected devices were assembled in 2013 and we have been active in the space since then with organic interposer technology, silicon interposer technology, non-interposer-based technologies and the IP needed to enable this technology.
eSilicon started the MoZAIC™ program (Modular Z-Axis Integrated Circuit) in 2011, focused on enabling the IP, design capability, packaging and test methodologies and supply chain needed to ensure the lowest-risk, highest-performance device development.

eSilicon 2.5D Project on Organic Interposer


eSilicon 2.5D Concept


eSilicon is connected to all levels of the semiconductor manufacturing supply chain: fabs, test and assembly companies, EDA companies and design houses. If you are interested in doing your first 2.5D or 3D project, we can help you make the right decisions. eSilicon will manage the entire supply chain using the fabs and assembly and test houses that are ready for 2.5D and 3D-ICs. eSilicon is already active in 2.5D and expects to be an early adopter of production-ready 3D technology.