2.5D/HBM2 Packaging & Solutions

Industry-Leading Custom 2.5D Solutions

eSilicon started the MoZAIC™ “Modular Z-axis Integrated Circuit” Program in 2011. As an ASIC provider for large, complex networking, communication, computing and deep learning systems, we began analyzing new approaches that would provide more bandwidth for our customers.

This includes the development of a high-bandwidth memory  (HBM/HBM2) PHYs in 28, 14/16 and 7nm technologies as well as proficiency in 2.5D packaging. eSilicon has completed multiple test chips to date that verify the HBM PHY IP, as well as assembled a supply chain in support of 2.5D integration — design, verification, test and reliability.

eSilicon has multiple FinFET 2.5D ASICs in design, with several entering production in 2018.

eSilicon 2.5D Concept

2.5D ASIC concept drawing


Example eSilicon HBM2/2.5D ASIC Design

HBM2/2.5D ASIC design image and highlights
  • 150M gates
  • 900Mb embedded SRAM
  • FCBGA with silicon interposer
  • One 4-high HBM2 stack
  • 60 lanes multi-protocol SerDes, 1 to 28Gb
  • eSilicon IP:
    • HBM2 PHY
    • Memory compilers
    • Specialty I/O
    • Custom memory instances optimized for power, performance, area
    • TCAM (supports 1.2G searches/second)

Comprehensive 2.5D Design & Implementation

  • 2.5D ecosystem management
  • 2.5D interposer and package design
  • Interposer and package routing
  • Design for manufacturability (DFM)
  • Signal integrity/power integrity design and analysis
  • Thermal integrity
  • Warpage analysis
  • Single production source for:
    • Acquisition/assignment of all die in package
    • Assembly
    • Test
    • Delivery of final, tested, yielded devices

eSilicon HBM2 PHY and Controller

Our hardened HBM2 PHY was designed to support a wide variety of OEM customers in high-performance market segments from 28nm to 7nm. Through our partnership with Northwest Logic, we offer a comprehensive HBM interface including both the controller and the PHY, which is silicon validated in an integrated system that includes the interposer and DRAM stack.

Front-end views of our 7nm HBM PHY are available now by contacting sales@esilicon.com.

Key features of eSilicon’s 7nm HBM2 PHY:

PHY Feature Specification
Data Rate 0.1-2.4Gbps per I/O
Channels 8 independent channels
Self-Refresh Supported through memory controller
I/O per Channel 212
Channel Bandwidth Up to 307GB/s
Data I/O 128 per channel, 8 channels and 16 pseudo channels
ECC ECC and parity support in conjunction with the controller. (ECC on DM signals)
Data Byte Invert (DBI) DBI supported in conjunction with the controller
Data Mask (DM) DM supported in conjunction with the controller
RAS Support RAS supported in conjunction with the controller
Cycles/Command 1 cycle (exception is Row Activate at 2 cycles) per JEDEC specification
Interoperability Testing Supports any third-party DFI 4.0-compliant memory controller vendor
IEEE1500 Support Separate IEEE1500 port for direct access to the memory stack and PHY
Impedance Calibration Sharing Self-contained calibration per PHY instance across all eight channels
Related Signal Pass-Through Provides ability for signals not related to PHY to be passed through
Power-Down Modes IDDQ MODE and dynamic power-down of receivers during WRITE
Temperature Range (Tj) -40C to 125C
Voltage Level Target VDD (logic supply) at circuit: 0.675V -> 0.99V
I/O supply voltage – at die level 1.2V (+/-5%)

Contact & Online Access

Please contact us at sales@esilicon.com for more information, silicon quality results, white papers, complete data sheets, design kits or front-end views.

All eSilicon IP is available in IP Navigator at https://star.esilicon.com, our online IP exploration tool. Navigator provides access to eSilicon’s full portfolio of IP products. Memory instances may be generated, analyzed and downloaded. Power, performance, and area (PPA) data is pre-loaded for easy data comparison and analysis.

Resources

Additional details on our high-performance offering can be found in our 17nm IP Platform, Ternary CAM and HBM2 PHY brochures.

Our newest HBM white paper, co-authored with SK Hynix, Amkor Technology, Northwest Logic and Avery Design Systems, is available online: Start Your HBM/2.5D Design Today.

You may also be interested in our Advanced ASIC Video Series:

  • What is High-Bandwidth Memory (HBM2) and 2.5D Packaging?
  • What is a TCAM?
  • Where is a TCAM Used in an ASIC?