Webinar Video: 10-Minute GDSII Tapeout Quotes

Re-play of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal.  Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes.  We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.

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Instant MPW Quotes: New Die Packaging Services

Request a free account and explore your multi-project wafer (MPW) production options with no obligation. Our newest MPW quoting tool includes standard IC package options.
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In the News Archive: 2011

December 15, 2011
Rebalancing Power, Performance And Area
System-Level Design
December 13, 2011
Experts at the Table: Stacked Die and the Supply Chain
Part 1 | Part 2 | Part 3
Semiconductor Manufacturing & Design
December 8, 2011
eSilicon Recognizes Magma With 2011 Supplier of the Year Award
Yahoo! Finance
December 1, 2011
Synopsys to buy Magma to address 20nm chip design
Electronics Weekly
November 17, 2011
Make Vs. Buy
System-Level Design
November 16, 2011
Memory Challenges in the Extreme
System-Level Design
November 10, 2011
eSilicon Uses Magma to Tape Out 28-nm 1.5GHz Microprocessor Cluster for Embedded Platforms
MSNBC
October 26, 2011
Fabless ASIC Vendors to Expand Design Service
Semiconductor Manufacturing & Design
October 25, 2011
eSilicon Selects Synopsys' Custom IC Design Solution and Tapes Out 28nm Designs
Electronic Engineering Journal
October 20, 2011
Derivative Designs Demand Discipline
System-Level Design
VIP: Behind the Velvet Rope
System-Level Design
October 19, 2011
The Next SoC
System-Level Design
October 14, 2011
Experts at the Table: Which Comes First
Part 1 | Part 2 | Part 3
System-Level Design
October 11, 2011
Strengthening Supply Chain Links
EBN
1.5GHz microprocessor cluster targets SoC design
EE Times Asia
October 10, 2011
GLOBALFOUNDRIES start fabbing 28nm wafers:
First chip is a triple-core MIPS-based design from eSilicon

SemiAccurate
October 7, 2011
GLOBALFOUNDRIES produces first 28nm MIPS multi-processor
Electronics Weekly
September 22, 2011
Solid Verification Methodology Essential To Productivity
Chip Design
September 19, 2011
eBeam Initiative Members Present Collaborative Results at SPIE/BACUS Photomask Symposium 2011
Bloomberg
July 28, 2011
3D Stacking: A Reality Check
System-Level Design
July 17, 2011
SoC Ecosystems Become More Tightly Integrated
Chip Design
July 15, 2011
Experts At The Table: 2.5D Stacked Die
Part 1 | Part 2 | Part 3
Chip Design Magazine
July 12, 2011
GSA to Host Inaugural Semiconductor Ecosystem Summit
EDA Cafe
June 17, 2011
EDA World Embracing IP Subsystems
EBN
June 14, 2011
Viable Product Development at 22 nm
Why an integrated value chain is becoming critical and where to find the necessary expertise to make all the pieces work together

ChipEstimate IP Connections
June 7, 2011
SoC Ecosystems Become More Tightly Integrated
Chip Design Magazine
June 3, 2011
One-on-one: Jack Harding (video)
System-Level Design
June 1, 2011
Flying Lizard Reveals Special Livery for Team's First Two-Porsche Le Mans Program
Breitbart
May 26, 2011
The Upside Of Dark Silicon
System-Level Design
Who's In Control?
System-Level Design
May 17, 2011
The Growing Importance Of Subsystems
EECatalog
April 28, 2011
Manufacturing Challenges At 22nm And In Stacked Die
System-Level Design
April 12, 2011
TranSwitch engages eSilicon
EE Times
April 1, 2011
Billion-gate design challenges
Part 1 | Part 2 | Part 3 | Video
Low-Power Engineering
March 31, 2011
The Quest For A Better IP Integration Methodology
System-Level Design
March 14, 2011
Experts At The Table: 3D Stacking
Part 1 | Part 2 | Part 3 | Video
Semiconductor Manufacturing & Design
February 25, 2011
The Growing Importance Of Subsystems
System-Level Design
Thru-Silicon Vias: Current State of the Technology
SOCcentral
February 18, 2011
Experts At The Table: Concurrent Design
Part 1 | Part 2 | Part 3 | Video
Low-Power Design
February 16, 2011
Will IP & EDA Be Better Together?
Chip Design Magazine
February 1, 2011
The turning point for MCMs
Yole 3D Packaging Magazine
January 28, 2011
Remaking The Design Landscape
System-Level Design
January 27, 2011
Tailoring IP, Tools And Flows
System-Level Design
Connecting System-Level Flows To Implementation Tools
System-Level Design