esilicon-automated-gdsii-mulresources/webinars-and-technical-presentations

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Webinar Video:
10-Minute GDSII
Tapeout Quotes

Replay of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal.  Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes.  We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.

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Instant MPW Quotes: New Die Packaging Services

Request a free account and explore your multi-project wafer (MPW) production options with no obligation. Our newest MPW quoting tool includes standard IC package options.
MPW shuttle service details>>>

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IP Catalog

Our complete portfolio of customizable semiconductor IP and I/Os is available at ChipEstimate.com.

Multi-Project Wafer Quotes

Free, Automated Online Multi-Project Wafer Quote System Delivers Instant Pricing

eSilicon's free, automated online quote system for multi-project wafer (MPW) shuttle services delivers instant, executable quotes. It allows users to evaluate the wafer cost of multiple options in real time at no cost or obligation. Because the form is automated, it also prevents costly user errors. Unlike online estimation tools you might find on other websites, eSilicon stands behind the details of the quotes generated by this system. We deliver a real, ready-to-sign quote.

You'll get the same information that it can take up to a week to get using a manual process. The service is accessed through user-friendly web or smartphone interfaces. We have recently added standard IC packaging services to the online MPW quote system.

Like the rest of the eSilicon Online Tool Suite, the MPW quoting tool is available at no charge or obligation.

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Why Multi-Project Wafers?
MPWs reduce prototype cost by up to 90 percent versus a full production mask by grouping multiple IC designs on one mask set. The mask costs are shared by multiple program participants and are a good choice in a variety of scenarios:

  • Product prototyping
  • Verification of IP, standard-cell libraries and I/Os
  • Device characterization
  • Low-volume requirements
  • Research or early development projects looking for proof of concept
  • IP supplier experimentation with new circuitry or verification of working silicon

Online Technology Choices
eSilicon's MPW services are available online in the following technologies in multiple flavors from TSMC, GLOBALFOUNDRIES, UMC, SMIC, Altis and TSI. For more options, please contact us at This e-mail address is being protected from spambots. You need JavaScript enabled to view it .

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MPW Packaging Services
The following packaging services are available online. Please contact us regarding custom IC packaging or standard packages not listed here.

  • Wirebond Leadframe
    • QFN 4mm x 4mm – 12mm x 12mm
    • QFP 10mm x 10mm – 14mm x 14mm
  • Wirebond BGA
    • TFBGA 4mm x 4mm – 18mm x 18mm
    • PBGA 17mm x 17mm – 35mm x 35mm
  • Flip Chip BGA
    • FCBGA 12mm x 12mm – 35mm x 35mm

Foundry Engineering Support
Once an MPW order is in process, eSilicon's foundry engineering team provides a number of services to ensure quality in production, including:

  • Validate database integrity
  • Validate CAD content
  • Validate process options and attributes
  • Submit tooling request after thorough data collection and checking
  • Address mismatches between the database and plan of record
  • Address database and mask shop issues during data conversion and mask making
  • Assess DRC violations

Like the rest of the eSilicon Online Tool Suite, the MPW quoting tool is available at no charge or obligation.

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GDSII Handoff to TSMC: Generate a Quote in Less Than 10 Minutes
When you are ready for volume production, eSilicon's new automated GDSII quoting portal offers the ability to fully specify the manufacturing process requirements to submit a GDSII design to TSMC. It takes less than 10 minutes to complete the process and receive an executable quote.

Additional Options and Services
Please contact us at This e-mail address is being protected from spambots. You need JavaScript enabled to view it if you have any questions or want to discuss additional options and services, such as testing, standard IC packages not listed here, custom die packages, seal rings or additional foundry or technology choices.