ASIC Design
Few companies can afford a full-time staff with all of the capabilities needed for each custom chip project. At eSilicon, we maintain a strong in-house team with a wide variety of special skills in IC design, to help provide the additional services needed to complete your chip project.
The company’s design services incorporate physical implementation and extensive package design including electrical simulation and thermal analysis. The design flows are based on industry-standard EDA tools and have a 100% timing closure success rate as well as a 98% first-time-silicon success rate.
eSilicon incorporates the latest design for test (DFT), package design & simulation, processor subsystem design & implementation, design for manufacturability (DFM) and signal integrity (SI) techniques to address any problems before a customer commits to silicon.
Traditional design service providers may be skilled at physical design itself, but offer little else. They have little or no experience in taking designs to volume production, do not take into account “system” design considerations, have no debugging capabilities, lack skills in other crucial design areas such as package design and DFT and have limited knowledge of third-party IP.
With eSilicon, the customer gets it all! Our design activity is for devices we ultimately manufacture. The company has a wide breadth of design skills and understands the full development and manufacturing process, including quality control.
eSilicon also has access to a wide range of technologies from an extensive network of Value Chain partners, including industry-leading third-party IP providers, making it possible to provide customized solutions based on the industry's best and most advanced chip technologies.
| eSilicon - Enabling Your Silicon Success™ Home : Offerings : Customers : Partners : About Us : Contact : Privacy Policy : Legal ©2002-2010 eSilicon Corporation - an ASIC Design, Productization & Manufacturing Service Company |
  
|