What is IC Design Virtualization?

Find out more with our IC design virtualization white paper series:

  • Design Virtualization and Its Impact on SoC Design

  • Design Virtualization Technology for Low-Power ASICs

Papers

TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

Request a copy of this application note by email.

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IP Catalog

Our complete portfolio of customizable semiconductor IP and I/Os is available at ChipEstimate.com.

eSilicon STAR MPW Explorer

Evaluate Options and Get Fast, Accurate Quotes for Multi-Project-Wafer Shuttle Services

Quote and Compare − Free, Automated Online Multi-Project-Wafer Quote System Delivers Instant Pricing

eSilicon's free, automated online quote system for multi-project wafer (MPW) shuttle services delivers instant, executable quotes. It allows users to evaluate the wafer cost of multiple options in real time at no cost or obligation. Because the form is automated, it also prevents costly user errors. Unlike online estimation tools you might find on other websites, eSilicon stands behind the details of the quotes generated by this system. We deliver a real, ready-to-sign quote.

You'll get the same information that it can take up to a week to get using a manual process. The service is accessed through user-friendly web or smartphone interfaces. We have recently added standard IC packaging services to the online MPW quote system.

Like the rest of the eSilicon STAR Tool Suite, MPW Explorer is available at no charge or obligation.

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Why Multi-Project Wafers?
MPWs reduce prototype cost by up to 90 percent versus a full production mask by grouping multiple IC designs on one mask set. The mask costs are shared by multiple program participants and are a good choice in a variety of scenarios:

  • Product prototyping
  • Verification of IP, standard-cell libraries and I/Os
  • Device characterization
  • Low-volume requirements
  • Research or early development projects looking for proof of concept
  • IP supplier experimentation with new circuitry or verification of working silicon

Online Technology Choices
eSilicon's MPW services are available online in the following technologies in multiple flavors from TSMC, GLOBALFOUNDRIES, UMC, SMIC, Altis, CSMC and TSI. For more options, please contact us at star@esilicon.com.

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MPW Packaging Services
The following packaging services are available online. Please contact us regarding custom IC packaging or standard packages not listed here.

  • Wirebond Leadframe
    • QFN 4mm x 4mm – 12mm x 12mm
    • QFP 10mm x 10mm – 14mm x 14mm
  • Wirebond BGA
    • TFBGA 4mm x 4mm – 18mm x 18mm
    • PBGA 17mm x 17mm – 35mm x 35mm
  • Flip Chip BGA
    • FCBGA 12mm x 12mm – 35mm x 35mm

Foundry Engineering Support
Once an MPW order is in process, eSilicon's foundry engineering team provides a number of services to ensure quality in production, including:

  • Validate database integrity
  • Validate CAD content
  • Validate process options and attributes
  • Submit tooling request after thorough data collection and checking
  • Address mismatches between the database and plan of record
  • Address database and mask shop issues during data conversion and mask making
  • Assess DRC violations

Like the rest of the eSilicon STAR Tool Suite, MPW Explorer is available at no charge or obligation.

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New, Simplified MPW Explorer Quoting Interface

star-mpw-explorer

GDSII Handoff to TSMC: Generate a Quote in Less Than 10 Minutes
When you are ready for volume production, eSilicon's  automated GDSII quoting portal, GDSII Explorer, offers the ability to fully specify the manufacturing process requirements to submit a GDSII design to TSMC. It takes less than 10 minutes to complete the process and receive an executable quote.

Additional Options and Services
Please contact us at star@esilicon.com if you have any questions or want to discuss additional options and services, such as testing, standard IC packages not listed here, custom die packages, seal rings or additional foundry or technology choices.