esilicon-automated-gdsii-mulresources/webinars-and-technical-presentations

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Webinar Video:
10-Minute GDSII
Tapeout Quotes

Replay of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal.  Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes.  We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.

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TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

Request a copy of this application note by email.

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Instant MPW Quotes: New Die Packaging Services

Request a free account and explore your multi-project wafer (MPW) production options with no obligation. Our newest MPW quoting tool includes standard IC package options.
MPW shuttle service details>>>

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GDSII Quotes

eSilicon offers an automated online GDSII quote system for TSMC. You can choose all the requirements to tapeout a chip to TSMC in less than 10 minutes, then receive a complete, executable quote in seconds. You can also perform "what if" analyses to determine the affect your choices have on the chip's cost in volume production.

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The eSilicon® flexible engagement model allows customers to hand off their design to us at RTL level, netlist level, GDSII level or the production level, with eSilicon delivering high-yielding, tested and packaged chips with our customer's logo on them.

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