What is IC Design Virtualization?

Find out more with our IC design virtualization white paper series:

  • Design Virtualization and Its Impact on SoC Design

  • Design Virtualization Technology for Low-Power ASICs


TCAM Application Note: Streamline Multi-Byte Searches With TCAM Arrays

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

Request a copy of this application note by email.


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Products and Services

Traditional ASIC Design Services

Our ASIC business unit provides fast time-to-market solutions by de-risking IP selection, DFT (design for test) assessment, package/substrate design, and chip implementation.

Semiconductor Manufacturing Services

Silicon manufacturing services are an option for FSCs and OEMs who want to get out from under the burden of managing volume ASIC production.

Custom Memory IP

Our custom IP solutions provide a unique way for our customers to optimize their ASICs for performance, power and area (PPA). We offer an array of 14/16nm-180nm silicon-proven custom memories, including cache, CAM, SRAM, ROM, and MPRF.

Value-Added Services

eSilicon offers a range of special additional services, including sub-system design optimization, custom 3D and 2.5D packaging, and CAST™ (Component Auto-generation System for Test chips) services.

eSilicon STAR Online Tool Suite

The eSilicon® STAR design virtualization platform is an automated online secure environment that provides a self-service, transparent, accurate, real-time experience from IC design through volume ASIC production. The platform includes a suite of automated online tools for IP exploration, block- and chip-level SoC optimization services, and work-in-proces (WIP) tracking.

Engagement Solutions

eSilicon delivers ASICs and ASSPs to OEMs and fabless semiconductor companies (FSCs) through a fast, flexible, lower-risk path to volume production by deploying our comprehensive suite of design through manufacturing services. We serve a wide variety of markets including the communications, computer, consumer, medical and industrial segments.

Engage at the Level That Best Suits Your ASIC Design

The eSilicon® flexible engagement model allows customers to hand off their design to us at RTL level, netlist level, GDSII level or the production level, with eSilicon delivering high-yielding, tested and packaged chips with our customer's logo on them.

eSilicon Engagement Model


Re-Focus on Your Core Business

Whether you need ASICs or ASSPs, custom semiconductor IP to optimize your chip’s performance, or semiconductor manufacturing services to drive your proven chip through volume production, let us manage your design through production so you can focus on R&D for your next innovation.