Mainstream ASICs

A Fast, Flexible Low-Risk ASIC Journey

eSilicon has been providing its customers a fast, flexible and low-risk path to production ASICs for many years.  From concept to volume production, we deliver the right design support, IP, packaging and manufacturing technology. We focus on optimizing for the combination of power, performance, and area (PPA) appropriate for your device’s specific targets.

We have a proven track record in complex ASIC design, with over 98% first-time silicon success rate. We are a leading provider of SerDes and ARM core-based ASICs.

  • Our comprehensive partner network gives you the flexibility you need to get your design to market fast
  • Our extensive IP portfolio provides design support from 180nm to 7nm, including:
    • 56G/112G long-reach SerDes
    • High-speed single-port ternary CAM (SP TCAM) compiler
    • High-speed single-port fast cache (FC) compiler
    • High-speed single-port (SP) SRAM compiler
    • High-speed dual-port (DP) SRAM compiler
    • High-speed 2-port asynchronous register file (2PARF) compiler
    • High-speed pseudo 2-port (P2P) SRAM compiler
    • Ultra-high-density (UHD) pseudo 2-port (P2P) SRAM compiler
    • High-speed pseudo 4-port (P4P) SRAM compiler
    • High-speed pseudo quad-port (PQP) SRAM compiler
    • 1024-bit HBM2 PHY
    • High-bandwidth interconnect (HBI)
    • 1.8V oxide 1.8V LVDS I/O library
    • 1.8V oxide 1.8V/2.5V/3.3V general-purpose I/O library

Flexible engagement models to support every scenario

Whether it’s a full chip design or a GDSII handoff, eSilicon has an engagement model that will fit your needs.

We support our customers with comprehensive quality, product/foundry engineering, packaging and test engineering services – we’re there every step of the way from concept to volume production.

Design Tasks Spec RTL Netlist Placed gates GDS-II
Architecture/RTL/DV
Synthesis
Physical design Shared
DFT
Third-party IP
Package/2.5D/3D design
NPI
Production

Please contact us at sales@esilicon.com to find out more.