IC Packaging Services

Sophisticated IC Packaging Expertise

Packaging expertise at eSilicon covers many disciplines, from traditional IC packaging to 2.5D and 3D. We take a holistic approach to package selection, identifying the solutions best suited for a given application. The considerations made at the very beginning of a project include the following:

  • Signal count/type
  • Signal integrity
    • Power delivery
    • Isolation/crosstalk
    • Signal transition
    • Electromagnetic interface (EMI)
  • PCB routing options
  • Space requirements
  • Cost considerations
  • Thermal considerations
  • Volume vs. assembly source
  • Reliability considerations

Flip Chip BGA Package Technology

Si Node (nm) 28/14 10/7
Die Size (mm)
180um pitch 28 32
150um pitch 26 28
130um pitch N/A 26
Interposer Size (mm) 44×26 46×32
Bumping Technology 150um Lead Free 150um Cu Pillar
Package Body Size (mm)
1.0mm pitch 60 65
0.8/1.0mm mix pitch 45 50
0.8mm pitch 40 45
Substrate Material
Core E705G E705GX Coreless
Build Up GX13/GZ41 GX92/GZ41
SR SR7300G SRF/SRFA

Flip Chip BGA Package Structures

MCM (<=55mm, <=6 Si) package image
MCM
(<=55mm, <=6 Si)
Lidded FCBGA (55mm) package image
Lidded FCBGA
(<=55mm)
(55mm, Passive Interposer) package image
2.5D FCBGA
(<=55mm, Passive Interposer)
Lidded FCBGA with Backside Passives package image
Lidded FCBGA With Backside Passives
Ring FCBGA With or W/O Backside Passives package image
Ring FCBGA With or W/O Backside Passives
Bare Die FCBGA (cost saving) package image
Bare Die FCBGA
(Cost Saving)
2.5D FCBGA (>=65mm, Passive Interposer) package image
2.5D FCBGA
(>=65mm, Passive Interposer)
INFO-OS, Fan Out WLP (55mm) package image
INFO-OS, Fan Out WLP
(<=55mm)
MCM (>=65mm, >=12 Si, >=150um bump pitch) package image
MCM
(>=65mm, >=12 Si, >=150um bump pitch)
Large FCBGA with Ring or Lid (75mm) package image
Large FCBGA With Ring or Lid
(<=75mm)
Coreless FCBGA (35mm) package image
Coreless FCBGA
(<=35mm)

Wafer-Level Chip Scale Package Technology (WLCSP)

Package variants
  • CSPnl – BoR (Bump on Repassivation)
  • CSPnl – RDL (Bump on Redistribution)
  • CSPn3
Package sizes 0.08×0.08mm to 7x7mm

Wafer-Level Chip Scale Package Structures

CSPnl-BoR Cross Section

CSPnl-BoR – Cross Section

CSPnl-RDL Cross Section

CSPnl-RDL – Cross Section

CSPn3 Cross Section

CSPn3 – Cross Section

Array Package Technology (TFBGA)

Package Variants
  • ChipArray BGA (CABGA, LFBGA, FBGA, 1.2~1.7mm Package Thickness)
  • Thin ChipArray BGA (CTBGA, TFBGA, 1.0~1.2mm Package Thickness)
  • Very Thin ChipArray BGA (CVBGA, VFBGA, 0.8~1.0mm Package Thickness)
Package Sizes 3x3mm to 19x19mm

Thin Chip Array Ball Grid Array Package Structures

TFBGA Cross Section

TFBGA – Cross Section

Plastic Ball Grid Array Package Technology (PBGA)

Package Variants PBGA, MCM-PBGA (Multi-Chip Module PBGA)
Package Sizes 15x15mm to 45x45mm
Package Variants
  • TEPBGA-2 (Thermally Enhanced PBGA)
  • TEPBGA-3
  • TEPBGA-2S
  • HSBGA (Heat Slug Ball Grid Array)
Package Sizes 19x19mm to 45x45mm

Plastic Ball Grid Array Package Structures

TEPBGA-II / HSBGA Cross Section

TEPBGA-II / HSBGA – Cross Section

Quad Flat Package Technology (QFP)

Package Variants
  • QFP (from 2mm package thickness)
  • LQFP (low profile QFP, from 1.4mm package thickness)
  • TQFP (thin QFP, from 1mm package thickness)
  • Thermally enhanced variants available for all options
Package Sizes 5x5mm to 40x40mm

Quad Flat Package Structures

Quad Flat Package Structures

QFP – Cross Section

Quad Flat No-Lead Package Technology (QFN)

Package Variants
  • QFN, DR-QFN (Dual-Row QFN)
  • DFN (Dual Flat No-Lead)
  • All QFN Packages are 0.9mm Thick
Package Variants for Prototyping
  • Open-Cavity QFN
  • FC-QFN (Flip Chip QFN)
  • FC-MQFN (Flip Chip Molded QFN)
Package Sizes 3x3mm to 12x12mm

Quad Flat No-Lead Package Structures

Quad Flat No-Lead Package Structures

QFN – Cross Section