Quality Policy

eSilicon is committed to delivering products and services that exceed customers’ expectations through excellence in quality, speed and cost. This is achieved through our commitment to satisfy applicable requirements and continual improvement in our quality management system.

Quality Management System

Our quality management system (QMS) supports many different market segments, product technologies and customer requirements. eSilicon has a flexible business model to support our customers, which is easily enabled by the processes we have implemented. Customer service is our priority and we take pride in producing high-quality deliverables to meet customer expectations with a high level of customer satisfaction.


eSilicon’s documentation and quality management infrastructure supports complex products. Tier-one customers have successfully audited and qualified our design and manufacturing systems. Our closed-loop system and validation efforts produce repeatable manufacturing results, which can significantly reduce customer issues or manufacturing defects. Our supplier management process can effectively identify process issues and deficiencies in systems prior to production volume ramps.

Process & Systems

eSilicon has developed a comprehensive system to organize and track all customers, products and environmental variants; it provides a secure and accurate representation of customer and product requirements. Our supplier arrangements support a streamlined manufacturing process, delivering a reliable, high-quality outcome for fab, assembly and test operations.

Reliability & Failure Analysis

Reliability is one of our key customer support strengths: our ability to design, manufacture and implement complicated qualification programs for customers not only creates a win-win scenario for our customers, but also allows for reliable products to be shipped into the field.

Reliability Services

  • High-temperature operating life (HTOL)
  • Preconditioning per JEDEC-A113, all levels
  • Temperature-humidity bias testing
  • Highly accelerated stress bias testing (HAST)
  • Temperature cycling
  • High-temperature storage
  • Low-temperature burn-in
  • Thermal shock
  • Autoclave (pressure cooker) testing
  • High-power burn-in
  • ESD/latch-up for high pin-count devices
  • Other services available upon request

Failure Analysis Services

  • I/V characterization (curve trace)
  • Microprobing
  • Picoprobing up to 3 GHz
  • Optical microscopic examination
  • Chemical or mechanical decapsulation
  • Real time X-ray
  • Scanning acoustic microscopy (C-SAM)
  • Scanning electron microscopy (SEM) systems
  • Energy dispersive X-ray analysis (EDX)
  • Emission microscopy
  • Hot-spot analysis
  • Chemical deprocessing
  • Plasma etching
  • Parallel lapping
  • Cross sectioning
  • Ball shear / bond pull
  • Failure analysis reports
  • Other services available upon request