STEM Scholarships in Vietnam

Sunflower Mission 2017
Engineering & Technology Scholarship for Excellence

The Sunflower Mission Engineering & Technology Scholarship for Excellence Program, in collaboration with the technology industry, is a program that offers scholarship awards to undergraduate students in circuit design engineering or software development related disciplines. The program aims to recognize students demonstrating excellence in the fields of science, technology, engineering and math (STEM) and to encourage outstanding global citizenship. The program is managed by eSilicon Vietnam.

Eligibility:

The scholarship program is open to Vietnamese students who are completing a bachelor’s degree in engineering or technology, from second year to final year in 2017 -2018. The following qualities will be evaluated in determining the scholarship winners:

  • Passion, drive and career ambition in their study of engineering or other technology field, in particular, related to circuit design or software development
  • Academic excellence with a latest full academic year GPA score of 7.0 or above
  • Determination to set and achieve goals
  • Respect for self, family and contribution to helping others in the community
  • Future ability and passion to lead and assist others in Vietnam and globally
  • English language skills

If you possess any or all of these qualities, we are very interested in receiving your scholarship application!

Target Universities:

There are a number of key target universities in HCMC and Da Nang for student applications.
HCMC

  • University of Technology
  • University of Science
  • University of Technology Education
  • Post and Telecommunications Institute of Technology
  • University of Information Technology
  • National University (International University)
  • Vietnam German University

Da Nang

  • University of Technology
  • Duy Tan University

If students from other universities in HCMC and Da Nang believe they meet all the required selection criteria then eSilicon Vietnam and Sunflower Mission reserve the right to accept such applications, however, this action is at their sole discretion and they are under no obligation to do so.

Scholarship Value:

  • In 2017, up to 60 scholarship winners will receive a scholarship payment of VND 6,500,000
  • Top-level winners will be offered an internship or conditional graduate employment with eSilicon Vietnam.
  • Additional prize awards for special categories including Top Female Engineers and Top Essays
  • Winners are eligible to join the Sunflower Mission E& T Scholarship Award Winners Alumni Group

Assessment Process:

Assessment of applications will be completed on the following basis:

Step 1 — Students submit a completed online application form and upload their transcript and essay in English

  • Submit a completed online application form
  • Upload transcript information — GPA of 7.0 or above required
  • Upload a 500-word English essay on one IC design or one software development topic. There are separate essay topics (see below)
    • Students who expect to graduate in 2019 or later
    • Final-year students who expect to graduate in 2018

Step 2 — Shortlisting for interview

Based on application information, academic results + essay score, qualified students will be invited to an interview

Step 3 — Interviews conducted in HCMC and Da Nang

Shortlisted candidates will have technical and non-technical Interviews at eSilicon offices in HCMC and Da Nang. The technical interview will be conducted in Vietnamese language and it is preferred that the non-technical interview be conducted in English.

Step 4 — Final decision on scholarship award winners

Based on overall assessments in the areas of application, academic record, essay score and interview results the award winners will be selected by the E & T Scholarship Assessment Committee

Scholarship Timeline:

29 August to 15 September 2017 University scholarship information sessions
16 October 2017 Deadline for receipt of applications
October & November 2017 Shortlisting of candidates and interviews held with invited candidates
4 and 5 December 2017 Award ceremonies held in Da Nang and HCMC


Application Process:

A complete online scholarship application must include the items below:

  1. Complete and submit the online application form
  2. Upload applicant’s most recent 3×4-inch photo
  3. Upload a copy of the official transcript showing latest full academic year GPA score of 7.0 or above
  4. Upload a 500-word essay in English that answers one of the questions below based on applicant’s current academic year/discipline
  5. Please note that the essay needs to be written in your own words. Any form of plagiarism will automatically disqualify you from this scholarship this year and in future years

ESSAY QUESTION TOPICS — IC DESIGN

Students who expect to graduate in 2019 or later — IC design:
Question: What is your opinion of the integrated circuit (IC) design industry and its success to date in Vietnam? Why does the technology and IC design industry interest you for your future career choice?

Final-year students who expect to graduate in 2018 — IC design:
Question: Describe an IC design or circuit design related project you were involved in, some technical challenges you or the team faced, and the outcomes achieved. Describe what you believe is the potential for Vietnam to participate in the future of the technology industry, specifically for IC design and semiconductor innovation.

ESSAY QUESTION TOPICS — SOFTWARE DEVELOPMENT

Students who expect to graduate in 2019 or later — software development:
Question: How do you believe new software development methodologies will affect the ability of companies to bring products to market in Vietnam? Why does the software development industry interest you for your future career choice?

Final-year students who expect to graduate in 2018 — software development
Question: What is the impact of machine learning/artificial intelligence (AI) on consumers and enterprise? What language is best suited for machine learning application development? How can we use AI/machine learning to address IC design challenges?

Application Deadline:

Applications close on 16 October 2017
eSilicon Vietnam and Sunflower Mission reserve the right to decline applications received after the above date.

Further Information and Contacts:

About Sunflower Mission:

Sunflower Mission is a 501(c)(3) non-profit organization committed to improving the lives of the people of Vietnam, mainly through educational assistance programs, and to provide life-leadership learning opportunities for our students in the United States. We select and support students on the basis of academic potential and needs without regard to race, religion, gender, and beliefs. We believe that education is one of the key elements in providing a better future for the children of Vietnam.

About eSilicon Corporation:

eSilicon is an independent provider of complex FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions. Its ASIC+IP synergies include complete, silicon-proven 2.5D/HBM2 and TCAM platforms for FinFET technology at 14/16nm as well as SerDes, specialized memory compilers and I/O libraries.

Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.

Collaborate. Differentiate. Win.

eSilicon Corporation has offices in North America, Europe and Asia. eSilicon Vietnam has over 300 employees at design centers in Ho Chi Minh City and Da Nang.


Note to Recruitment Firms, Agencies and Other Third Parties:

eSilicon does not accept agency or third-party resumes. Please do not forward resumes to any recruiting alias or employee unless requested in writing by an eSilicon HR/talent acquisition representative. eSilicon is not responsible for any fees related to unsolicited resumes. Resumes shall be deemed unsolicited if not requested from eSilicon in writing.

Candidate Privacy Policy

This text supplements eSilicon’s privacy policy.

eSilicon will use your personal information for recruitment- and employment-related purposes, and otherwise if you are offered a position or become employed by eSilicon.

By submitting your resume to eSilicon, you agree that it may be used for recruitment purposes (including transferring your information to other countries, or to other parties to perform specific services on behalf of eSilicon or other processing relevant to recruitment purposes). It will not be shared with others for non-recruitment purposes.

eSilicon recommends that you do not disclose sensitive personal characteristics (for example, gender, height, weight, religion, philosophical or political beliefs, financial data) in your resume or cover letters to eSilicon.

Resume Data Retention

eSilicon will not retain your personal information longer than is necessary for the purposes for which it is collected. Resumes may be retained in order to comply with various country requirements on applicant data reporting.

For candidates outside the U.S.: Your information will be processed and stored in the U.S. By submitting your resume, you are consenting to the export of your information to the U.S. for processing and storage.