March 14-15 | San Jose, California
The Open Compute Project Global Summit (OCP 2019) brings together more than 3,400 key decision makers, executives, engineers, developers and suppliers. Together, they help grow, drive and support the open hardware ecosystem in, near and around the datacenter and beyond.
eSilicon at OCP 2019
Join us in the Samtec booth for ongoing demonstrations of eSilicon’s 7nm FinFET-class SerDes over a five-meter Samtec cable.
SerDes Demonstration: Samtec booth at OCP 2019
Using Samtec ExaMAX Backplane Connector paddle cards and a five-meter ExaMAX Backplane Cable Assembly, eSilicon will demonstrate the performance, flexibility and extremely low power consumption of its 7nm, 56G PAM4 and NRZ DSP-based long-reach SerDes.
The demonstration will drive four high-speed SerDes lanes in three configurations:
- CPRI NRZ modulation with point-to-point links
- 50G Ethernet PAM4 modulation with point-to-point links
- 56 Gbps PAM4 modulation with point-to-point links
Real-time data associated with all channels will also be displayed to demonstrate the robustness and low power of the device, including:
- Voltage histograms, pre- and post-DSP
- Signal-to-noise ratio (SNR)
- Eye diagrams
- Bit error rate (BER) monitor
If you won’t be at OCP 2019, but would like to see the 7nm 56G full-DSP SerDes demo, contact firstname.lastname@example.org.